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  • Proceedings Article January 01, 2003

    Lin Jin; Albert Chee W. Lu; Lai L. Wai; Wei Fan; Aik Chong Tan; Kai Chong Chan

    Proc. ASME. 36908b; 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2:735-739.January 01, 2003
    doi: 10.1115/IPACK2003-35223