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Proceedings Papers

Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies

Yifan Luo, Shogo Tezuka, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A051, November 1–5, 2021

Paper No: IMECE2021-68489

DOI: https://doi.org/10.1115/IMECE2021-68489

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Topics: Alloys, Creep, Damage, Dislocations, Electron backscatter diffraction, Fatigue, Grain boundaries, Heat, Stress, Diffusion (Physics)

Proceedings Papers

Acceleration of Grain Boundary Cracking in Ni-Base Alloy 617 Under Creep-Fatigue Loading at 800°C

Kenta Ishihara, Yifan Luo, Hideo Miura

Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A062, November 16–19, 2020

Paper No: IMECE2020-23738

DOI: https://doi.org/10.1115/IMECE2020-23738

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Topics: Alloys, Cracking (Materials), Creep, Electron backscatter diffraction, Fatigue, Fracture (Process), Grain boundaries

Proceedings Papers

Degradation of the Strength of a Grain Boundary of Ni-Base Superalloys Under Creep-Fatigue Loading at Elevated Temperature

Yukako Takahashi, Yifan Luo, Kenta Ishihara, Shujiro Suzuki, Hideo Miura

Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A071, November 16–19, 2020

Paper No: IMECE2020-24473

DOI: https://doi.org/10.1115/IMECE2020-24473

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Topics: Creep, Electron backscatter diffraction, Fatigue, Grain boundaries, Superalloys, Temperature

Proceedings Papers

Crystallinity Dependence of Grain and Grain Boundary Strength of a Bicrystal Structure of Copper

Ken Suzuki, Yiqing Fan, Yifan Luo

Proc. ASME. IMECE2020, Volume 13: Micro- and Nano-Systems Engineering and Packaging, V013T13A004, November 16–19, 2020

Paper No: IMECE2020-23757

DOI: https://doi.org/10.1115/IMECE2020-23757

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Topics: Copper, Grain boundaries, Molecular dynamics

Proceedings Papers

Exact H2 Optimal Solutions to a SDOF System With Electromagnetic Tuned Inerter Damper for Vibration Control

Yifan Luo, Hongxin Sun, Xiuyong Wang, Anhua Chen, Lei Zuo

Proc. ASME. ISFA2020, 2020 International Symposium on Flexible Automation, V001T06A005, July 8–9, 2020

Paper No: ISFA2020-9653

DOI: https://doi.org/10.1115/ISFA2020-9653

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Topics: Dampers, Energy harvesting, Vibration control

Proceedings Papers

Grain Boundary Cracking of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures

Yan Liang, Yifan Luo, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2019, Volume 9: Mechanics of Solids, Structures, and Fluids, V009T11A056, November 11–14, 2019

Paper No: IMECE2019-11186

DOI: https://doi.org/10.1115/IMECE2019-11186

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Topics: Alloys, Cracking (Materials), Creep, Damage, Electron backscatter diffraction, Fracture (Materials), Fracture (Process), Grain boundaries, Nickel, Temperature

Proceedings Papers

Disappearance of Strengthened Micro Texture of Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures

Yifan Luo, Hideo Miura

Proc. ASME. IMECE2018, Volume 9: Mechanics of Solids, Structures, and Fluids, V009T12A055, November 9–15, 2018

Paper No: IMECE2018-87368

DOI: https://doi.org/10.1115/IMECE2018-87368

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Topics: Diffusion (Physics), Steel, Stress, Temperature, Texture (Materials), Alloys, Creep, Electron backscatter diffraction, Fatigue, Cycles

Proceedings Papers

Degradation of the Strength of a Grain and a Grain Boundary due to the Accumulation of the Structural Defects of Crystal

Guoxiong Zheng, Yifan Luo, Hideo Miura

Proc. ASME. IMECE2018, Volume 12: Materials: Genetics to Structures, V012T11A004, November 9–15, 2018

Paper No: IMECE2018-87264

DOI: https://doi.org/10.1115/IMECE2018-87264

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Topics: Crystals, Grain boundaries, Fracture (Materials), Fracture (Process), Electron backscatter diffraction, Atoms, Dislocations, Semiconductor devices, Thin films, Bonding

Proceedings Papers

Crystallinity-Induced Variation of the Yield Strength of Electroplated Copper Thin Films

Yifan Luo, Kunio Tei, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2017, Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Structural Health Monitoring and Prognosis, V009T12A034, November 3–9, 2017

Paper No: IMECE2017-70302

DOI: https://doi.org/10.1115/IMECE2017-70302

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Topics: Copper, Thin films, Yield strength, Tungsten, Electron backscatter diffraction, Grain boundaries, Deformation, Density, Ductile fracture, Errors

Journal citation

NARROW

Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies

Acceleration of Grain Boundary Cracking in Ni-Base Alloy 617 Under Creep-Fatigue Loading at 800°C

Degradation of the Strength of a Grain Boundary of Ni-Base Superalloys Under Creep-Fatigue Loading at Elevated Temperature

Crystallinity Dependence of Grain and Grain Boundary Strength of a Bicrystal Structure of Copper

Exact H2 Optimal Solutions to a SDOF System With Electromagnetic Tuned Inerter Damper for Vibration Control

Grain Boundary Cracking of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures

Disappearance of Strengthened Micro Texture of Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures

Degradation of the Strength of a Grain and a Grain Boundary due to the Accumulation of the Structural Defects of Crystal

Crystallinity-Induced Variation of the Yield Strength of Electroplated Copper Thin Films

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