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Proceedings Papers

Combining Heuristics With Inverse Kinematics for Automatic Path Planning

Emmanuel I. Agba, Ming Z. Huang, Tin-Lup Wong
Proc. ASME. CIE91, ASME 1991 Computers in Engineering Conference: Volume 2 — Finite Elements/Computational Geometry; Computers in Education; Robotics and Controls, 475-481, August 18–22, 1991
Paper No: CIE1991-0157
DOI: https://doi.org/10.1115/CIE1991-0157
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Topics: Kinematics, Path planning, Manipulators, Geometry, Trajectories (Physics)
Proceedings Papers

Solid Modeling of Subsea Telerobotic Manipulators Using Superquadrics for High Fidelity Simulation

Emmanuel I. Agba, Tin-Lup Wong, Ming Z. Huang, Andrew M. Clark
Proc. ASME. CIE91, ASME 1991 Computers in Engineering Conference: Volume 1 — Artificial Intelligence; Expert Systems; CAD/CAM/CAE; Computational Fluid/Thermal Engineering, 217-224, August 18–22, 1991
Paper No: CIE1991-0028
DOI: https://doi.org/10.1115/CIE1991-0028
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Topics: Manipulators, Ocean engineering, Simulation, Solid modeling, Collisions (Physics), End effectors, Solids
Proceedings Papers

Automated Hybrid Analysis of Surface Mounted Electronic Assemblies

Tin-Lup Wong, Junshi Wang, Karl K. Stevens
Proc. ASME. DETC90, 16th Design Automation Conference: Volume 1 — Computer Aided and Computational Design, 25-31, September 16–19, 1990
Paper No: DETC1990-0004
DOI: https://doi.org/10.1115/DETC1990-0004
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Topics: Deformation, Engineering simulation, Experimental analysis, Finite element methods, Optimization, Printed circuit boards, Simulation, Stress
Journal Articles

Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

Tin-Lup Wong, Karl K. Stevens, Gang Wang
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 244–249.
DOI: https://doi.org/10.1115/1.2905402
Published Online: September 1, 1991
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Topics: Dynamic models, Dynamic response, Electronic components, Lumber, Modal analysis, Mode shapes, Structural dynamics, Surface mount components, Surface mount packaging, Testing
Journal Articles

Fracture of Glass Seals in Surface Mount IC Packages

Karl K. Stevens, Tin-Lup Wong, Ajit Renavikar, Wayne Chen
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 162–167.
DOI: https://doi.org/10.1115/1.2904357
Published Online: June 1, 1990
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Topics: Fracture (Process), Glass, Surface mount packaging, Displacement, Ceramics, Finite element analysis, Fracture mechanics, Integrated circuits, Reliability
Journal Articles

Strength Analysis of Surface Mounted Assemblies Under Bending and Twisting Loads

Tin-Lup Wong, Karl K. Stevens, Junshi Wang, Wayne Chen
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 168–174.
DOI: https://doi.org/10.1115/1.2904358
Published Online: June 1, 1990
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Topics: Stress, Deflection, Deformation, Engineering simulation, Experimental analysis, Failure, Simulation, Simulation results