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Saibal Mukhopadhyay
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Proceedings Papers

Multi-Physics Driven Co-Design of 3D Multicore Architectures

He Xiao, Wen Yueh, Saibal Mukhopadhyay, Sudhakar Yalamanchili
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A038, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48533
https://doi.org/10.1115/IPACK2015-48533
View Paper titled, Multi-Physics Driven Co-Design of 3D Multicore Architectures
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Topics: Architecture, Design, Physics, Temperature, Delays, Energy efficiency, Circuits, Cycles, Energy consumption, Heat flux
Journal Articles

On-Chip Power Generation Using Ultrathin Thermoelectric Generators

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011005.
Paper No: EP-14-1012
https://doi.org/10.1115/1.4027995
Published Online: October 6, 2014
View Article titled, On-Chip Power Generation Using Ultrathin Thermoelectric Generators
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Topics: Electronic packages, Energy generation, Generators, Heat flux, Junctions, Stress, Temperature, Waste heat, Transients (Dynamics)
Proceedings Papers

Thermoelectric Generators Embedded in Microelectronic Chip

Owen Sullivan, Saibal Mukhopadhyay, Satish Kumar
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 961-968, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87953
https://doi.org/10.1115/IMECE2012-87953
View Paper titled, Thermoelectric Generators Embedded in Microelectronic Chip
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Topics: Generators, Energy generation, Energy consumption, Heat flux, Battery life, Electronic packages, Stress, Thermoelectric devices, Waste heat
Journal Articles

3D Compact Model of Packaged Thermoelectric Coolers

Owen Sullivan, Borislav Alexandrov, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031006.
Paper No: EP-13-1006
https://doi.org/10.1115/1.4024653
Published Online: June 24, 2013
View Article titled, 3D Compact Model of Packaged Thermoelectric Coolers
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Topics: Thermoelectric coolers, Cooling, Electronic packages, Steady state, Flat heat pipes
Proceedings Papers

Compact Model of Thermoelectric Coolers on a Micro-Electronic Chip

Owen Sullivan, Borislav Alexandrov, Saibal Mukhopadhyay, Satish Kumar
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 953-960, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64881
https://doi.org/10.1115/IMECE2011-64881
View Paper titled, Compact Model of Thermoelectric Coolers on a Micro-Electronic Chip
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Topics: Thermoelectric coolers, Electronic packages, Transients (Dynamics), Reliability, Simulation, Steady state, Control equipment, Control systems, Cooling, Design
Journal Articles

Array of Thermoelectric Coolers for On-Chip Thermal Management

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021005.
https://doi.org/10.1115/1.4006141
Published Online: June 11, 2012
View Article titled, Array of Thermoelectric Coolers for On-Chip Thermal Management
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Topics: Temperature, Thermoelectric coolers, Steady state, Cooling, Transients (Dynamics), Shapes, Temperature control
Journal Articles

Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors

Man Prakash Gupta, Minki Cho, Saibal Mukhopadhyay, Satish Kumar
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Electronic Cooling
J. Heat Mass Transfer. June 2012, 134(6): 061401.
https://doi.org/10.1115/1.4006012
Published Online: May 2, 2012
View Article titled, Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors
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Topics: Temperature, Thermal management
Proceedings Papers

Thermoelectric Coolers for Thermal Gradient Management on Chip

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 187-195, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38184
https://doi.org/10.1115/IMECE2010-38184
View Paper titled, Thermoelectric Coolers for Thermal Gradient Management on Chip
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Topics: Temperature gradient, Thermoelectric coolers, Cooling, Temperature, Transients (Dynamics), Electronic packages, Flat heat pipes, Shapes
Proceedings Papers

An Investigation of Power Migration Policies for Many-Core Processors to Manage On-Chip Thermal Profile

Man Prakash Gupta, Minki Cho, Saibal Mukhopadhyay, Satish Kumar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 153-163, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52094
https://doi.org/10.1115/IPACK2011-52094
View Paper titled, An Investigation of Power Migration Policies for Many-Core Processors to Manage On-Chip Thermal Profile
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Topics: Electronic packages, Energy dissipation, Integrated circuits, Reliability, Temperature, Temperature gradient, Thermal management