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Piyas Chowdhury
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Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8337
https://doi.org/10.1115/IPACK2018-8337
View Paper titled, On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties
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Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors
Journal Articles

Atomistic Energetics and Critical Twinning Stress Prediction in Face and Body Centered Cubic Metals: Recent Progress

Piyas Chowdhury, Huseyin Sehitoglu
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. April 2018, 140(2): 020801.
Paper No: MATS-17-1069
https://doi.org/10.1115/1.4038673
Published Online: January 19, 2018
View Articletitled, Atomistic Energetics and Critical Twinning Stress Prediction in Face and Body Centered Cubic Metals: Recent Progress
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Topics: Alloys, Crystals, Deformation, Dislocations, Nucleation (Physics), Stress, Twinning, Modeling, Energetics