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Michael J. Ellsworth
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Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1209
https://doi.org/10.1115/IMECE1997-1209
View Paper titled, Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling
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Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model
Proceedings Papers

Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness

Michael J. Ellsworth, Jr., Levi A. Campbell
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48324
https://doi.org/10.1115/IPACK2015-48324
View Paper titled, Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness
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Topics: Cooling, Thermal resistance, Heat sinks, Density, Flow (Dynamics), Fluids, Heat exchangers, Pressure, Specific heat, Water
Journal Articles

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041009.
Paper No: EP-13-1124
https://doi.org/10.1115/1.4028119
Published Online: September 19, 2014
View Article titled, Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit
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Topics: Design, Flow (Dynamics), Pumps, Reservoirs, Sensors, Temperature, Water, Valves, Algorithms, Electronics
Proceedings Papers

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A021, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73090
https://doi.org/10.1115/IPACK2013-73090
View Paper titled, Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit
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Topics: Design, Water, Heat, Stress, Cooling, Disks, Electronics, Flow (Dynamics), Heat exchangers, Motor drives
Journal Articles

An Overview of the IBM Power 775 Supercomputer Water Cooling System

Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020906.
https://doi.org/10.1115/1.4006140
Published Online: June 11, 2012
View Article titled, An Overview of the IBM Power 775 Supercomputer Water Cooling System
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Topics: Cooling systems, Water, Heat, Cooling, Electronics, Manufacturing
Proceedings Papers

An Overview of the Power 775 Supercomputer Water Cooling System

Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 221-229, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52130
https://doi.org/10.1115/IPACK2011-52130
View Paper titled, An Overview of the Power 775 Supercomputer Water Cooling System
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Topics: Cooling systems, Water, Heat, Stress, Cooling, Disks, Heat exchangers, Doors, Electronics, Energy efficiency
Proceedings Papers

Analysis and Design of the IBM Power 575 Supercomputing Node Cold Plate Assembly

Levi A. Campbell, Michael J. Ellsworth, Jr., Arvind K. Sinha
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 897-905, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89244
https://doi.org/10.1115/InterPACK2009-89244
View Paper titled, Analysis and Design of the IBM Power 575 Supercomputing Node Cold Plate Assembly
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Topics: Design, Manufacturing, Plates (structures), Computational fluid dynamics, Copper, Manifolds, Modeling, Tubing, Cooling, EPDM rubber
Proceedings Papers

Energy Efficiency Analyses and Comparison of Air and Water Cooled High Performance Servers

Michael J. Ellsworth, Jr., Madhusudan K. Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 907-914, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89248
https://doi.org/10.1115/InterPACK2009-89248
View Paper titled, Energy Efficiency Analyses and Comparison of Air and Water Cooled High Performance Servers
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Topics: Energy efficiency, Water, Cooling, Energy consumption, Heat, Stress, Air conditioning, Computational fluid dynamics, Condensers (steam plant), Cooling towers
Proceedings Papers

Experimental Investigation of the Heat Transfer Performance of Arrays of Round Jets With Sharp-Edged Orifices and Peripheral Effluent: Convective Behavior of Water on a Heated Silicon Surface

Levi A. Campbell, Michael J. Ellsworth, Jr., Madhusudan Iyengar, Robert Simons, Richard Chu
Proc. ASME. HT2005, Heat Transfer: Volume 4, 629-636, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72397
https://doi.org/10.1115/HT2005-72397
View Paper titled, Experimental Investigation of the Heat Transfer Performance of Arrays of Round Jets With Sharp-Edged Orifices and Peripheral Effluent: Convective Behavior of Water on a Heated Silicon Surface
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Topics: Heat transfer, Jets, Orifices, Silicon, Water, Flow (Dynamics), Construction, Exhaust systems, Fluids, Heat conduction
Proceedings Papers

Numerical Modeling of Jet Impingement and Validation of Convection: Conduction Decoupling in Thermal Design

Madhusudan Iyengar, Michael J. Ellsworth, Jr., Robert E. Simons, Levi A. Campbell
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 527-533, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73386
https://doi.org/10.1115/IPACK2005-73386
View Paper titled, Numerical Modeling of Jet Impingement and Validation of Convection: Conduction Decoupling in Thermal Design
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Topics: Computer simulation, Convection, Design, Heat conduction, Jets, Density, Heat transfer coefficients, Computational fluid dynamics, Cooling, Errors
Proceedings Papers

A Numerical Technique for Modeling Thermoelectric Cooler With Temperature Controller for Steady State CFD Applications

Kamal V. Karimanal, Michael J. Ellsworth, Jr., Gamal Refai-Ahmed
Proc. ASME. IMECE2003, Heat Transfer, Volume 1, 245-251, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42068
https://doi.org/10.1115/IMECE2003-42068
View Paper titled, A Numerical Technique for Modeling Thermoelectric Cooler With Temperature Controller for Steady State CFD Applications
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Topics: Computational fluid dynamics, Modeling, Steady state, Temperature controls, Thermoelectric coolers