1-9 of 9
Levi A. Campbell
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness

Michael J. Ellsworth, Jr., Levi A. Campbell
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48324
https://doi.org/10.1115/IPACK2015-48324
View Paper titled, Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness
Open the PDF for Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness in another window
Topics: Cooling, Thermal resistance, Heat sinks, Density, Flow (Dynamics), Fluids, Heat exchangers, Pressure, Specific heat, Water
Journal Articles

An Overview of the IBM Power 775 Supercomputer Water Cooling System

Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020906.
https://doi.org/10.1115/1.4006140
Published Online: June 11, 2012
View Article titled, An Overview of the IBM Power 775 Supercomputer Water Cooling System
Open the PDF for An Overview of the IBM Power 775 Supercomputer Water Cooling System in another window
Topics: Cooling systems, Water, Heat, Cooling, Electronics, Manufacturing
Proceedings Papers

An Overview of the Power 775 Supercomputer Water Cooling System

Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 221-229, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52130
https://doi.org/10.1115/IPACK2011-52130
View Paper titled, An Overview of the Power 775 Supercomputer Water Cooling System
Open the PDF for An Overview of the Power 775 Supercomputer Water Cooling System in another window
Topics: Cooling systems, Water, Heat, Stress, Cooling, Disks, Heat exchangers, Doors, Electronics, Energy efficiency
Proceedings Papers

Analysis and Design of the IBM Power 575 Supercomputing Node Cold Plate Assembly

Levi A. Campbell, Michael J. Ellsworth, Jr., Arvind K. Sinha
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 897-905, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89244
https://doi.org/10.1115/InterPACK2009-89244
View Paper titled, Analysis and Design of the IBM Power 575 Supercomputing Node Cold Plate Assembly
Open the PDF for Analysis and Design of the IBM Power 575 Supercomputing Node Cold Plate Assembly in another window
Topics: Design, Manufacturing, Plates (structures), Computational fluid dynamics, Copper, Manifolds, Modeling, Tubing, Cooling, EPDM rubber
Proceedings Papers

Experimental Investigation of the Heat Transfer Performance of Arrays of Round Jets With Sharp-Edged Orifices and Peripheral Effluent: Convective Behavior of Water on a Heated Silicon Surface

Levi A. Campbell, Michael J. Ellsworth, Jr., Madhusudan Iyengar, Robert Simons, Richard Chu
Proc. ASME. HT2005, Heat Transfer: Volume 4, 629-636, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72397
https://doi.org/10.1115/HT2005-72397
View Paper titled, Experimental Investigation of the Heat Transfer Performance of Arrays of Round Jets With Sharp-Edged Orifices and Peripheral Effluent: Convective Behavior of Water on a Heated Silicon Surface
Open the PDF for Experimental Investigation of the Heat Transfer Performance of Arrays of Round Jets With Sharp-Edged Orifices and Peripheral Effluent: Convective Behavior of Water on a Heated Silicon Surface in another window
Topics: Heat transfer, Jets, Orifices, Silicon, Water, Flow (Dynamics), Construction, Exhaust systems, Fluids, Heat conduction
Proceedings Papers

Numerical Modeling of Jet Impingement and Validation of Convection: Conduction Decoupling in Thermal Design

Madhusudan Iyengar, Michael J. Ellsworth, Jr., Robert E. Simons, Levi A. Campbell
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 527-533, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73386
https://doi.org/10.1115/IPACK2005-73386
View Paper titled, Numerical Modeling of Jet Impingement and Validation of Convection: Conduction Decoupling in Thermal Design
Open the PDF for Numerical Modeling of Jet Impingement and Validation of Convection: Conduction Decoupling in Thermal Design in another window
Topics: Computer simulation, Convection, Design, Heat conduction, Jets, Density, Heat transfer coefficients, Computational fluid dynamics, Cooling, Errors
Proceedings Papers

Experimental Study of Heat Transfer, Pressure Drop, and Dryout for Flow Boiling of Water in an Oil Heated Minichannel

Levi A. Campbell, Satish Kandlikar
Proc. ASME. ICMM2004, ASME 2nd International Conference on Microchannels and Minichannels, 601-608, June 17–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: ICMM2004-2387
https://doi.org/10.1115/ICMM2004-2387
View Paper titled, Experimental Study of Heat Transfer, Pressure Drop, and Dryout for Flow Boiling of Water in an Oil Heated Minichannel
Open the PDF for Experimental Study of Heat Transfer, Pressure Drop, and Dryout for Flow Boiling of Water in an Oil Heated Minichannel in another window
Topics: Boiling, Flow (Dynamics), Heat transfer, Pressure drop, Water, Temperature, Two-phase flow, Boundary-value problems, Copper, Flux (Metallurgy)
Proceedings Papers

Effect of Entrance Condition on Frictional Losses and Transition to Turbulence in Minichannel Flows

Levi A. Campbell, Satish Kandlikar
Proc. ASME. ICMM2004, ASME 2nd International Conference on Microchannels and Minichannels, 229-235, June 17–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: ICMM2004-2339
https://doi.org/10.1115/ICMM2004-2339
View Paper titled, Effect of Entrance Condition on Frictional Losses and Transition to Turbulence in Minichannel Flows
Open the PDF for Effect of Entrance Condition on Frictional Losses and Transition to Turbulence in Minichannel Flows in another window
Topics: Flow (Dynamics), Turbulence
Proceedings Papers

Effect of Entrance Condition on Frictional Losses and Transition to Turbulence

Satish G. Kandlikar, Levi A. Campbell
Proc. ASME. IMECE2002, Heat Transfer, Volume 4, 131-136, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39573
https://doi.org/10.1115/IMECE2002-39573
View Paper titled, Effect of Entrance Condition on Frictional Losses and Transition to Turbulence
Open the PDF for Effect of Entrance Condition on Frictional Losses and Transition to Turbulence in another window
Topics: Turbulence