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Proceedings Papers

General Nonlinear Analyses Using a Co-Rotational Finite Element Formulation

Lei Jiang
Proc. ASME. IMECE96, Development, Validation, and Application of Inelastic Methods for Structural Analysis and Design, 253-260, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0580
https://doi.org/10.1115/IMECE1996-0580
View Paper titled, General Nonlinear Analyses Using a Co-Rotational Finite Element Formulation
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Topics: Finite element analysis, Constitutive equations, Algorithms, Deformation, Displacement, Flow (Dynamics), Kinematics, Plasticity, Rigid-body mechanisms, Robustness
Proceedings Papers

Lateral Pressure Effects on the Ultimate Strength of Plates

Lei Jiang, Shengming Zhang
Proc. ASME. OMAE2015, Volume 3: Structures, Safety and Reliability, V003T02A100, May 31–June 5, 2015
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2015-41432
https://doi.org/10.1115/OMAE2015-41432
View Paper titled, Lateral Pressure Effects on the Ultimate Strength of Plates
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Topics: Plates (structures), Pressure, Tensile strength, Stress, Finite element analysis, Geometry, Load bearing capacity, Naval architecture, Oceans, Offshore structures
Proceedings Papers

A Method for Ultimate Strength Assessment of Plates in Combined Stresses

Shengming Zhang, Lei Jiang
Proc. ASME. OMAE2015, Volume 3: Structures, Safety and Reliability, V003T02A097, May 31–June 5, 2015
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2015-41101
https://doi.org/10.1115/OMAE2015-41101
View Paper titled, A Method for Ultimate Strength Assessment of Plates in Combined Stresses
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Topics: Plates (structures), Stress, Tensile strength, Finite element analysis, Design, Compressive stress, Engineering standards, Ocean engineering, Ships, Structural engineering
Proceedings Papers

Top Tensioned Riser Interface With Dry-Tree Semisubmersible

Sherry Xiang, Peimin Cao, Jeff Otten, Lei Jiang, Sean Bian
Proc. ASME. OMAE2014, Volume 6B: Pipeline and Riser Technology, V06BT04A053, June 8–13, 2014
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2014-24624
https://doi.org/10.1115/OMAE2014-24624
View Paper titled, Top Tensioned Riser Interface With Dry-Tree Semisubmersible
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Topics: Semi-submersible offshore structures, Top-tensioned risers, Pipeline risers, Risers (Casting), Design, Manufacturing, Pipes, Hull, Keel, Stress
Proceedings Papers

A Procedure for Non-Linear Structural Collapse Analysis

Shengming Zhang, Lei Jiang
Proc. ASME. OMAE2014, Volume 4A: Structures, Safety and Reliability, V04AT02A035, June 8–13, 2014
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2014-23397
https://doi.org/10.1115/OMAE2014-23397
View Paper titled, A Procedure for Non-Linear Structural Collapse Analysis
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Topics: Collapse, Finite element analysis, Boundary-value problems, Density, Design, Ocean engineering, Ships, Stress, Structural engineering
Proceedings Papers

Effect of Pressure on Collapse Behaviour of Stiffened Panel

Lei Jiang, Shengming Zhang
Proc. ASME. OMAE2014, Volume 4A: Structures, Safety and Reliability, V04AT02A042, June 8–13, 2014
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2014-23498
https://doi.org/10.1115/OMAE2014-23498
View Paper titled, Effect of Pressure on Collapse Behaviour of Stiffened Panel
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Topics: Collapse, Pressure, Stress, Finite element analysis, Hull, Failure mechanisms, Geometry, Girders, Load bearing capacity, Offshore structures
Proceedings Papers

Analysis of Fluid-Induced Excitation Forces in Triangular Tube Arrays Based on the LES Method

Qing-lei Jiang, Ji-yun Zhou, Xian-yuan Wang
Proc. ASME. ICONE21, Volume 3: Nuclear Safety and Security; Codes, Standards, Licensing and Regulatory Issues; Computational Fluid Dynamics and Coupled Codes, V003T10A040, July 29–August 2, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICONE21-16312
https://doi.org/10.1115/ICONE21-16312
View Paper titled, Analysis of Fluid-Induced Excitation Forces in Triangular Tube Arrays Based on the LES Method
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Topics: Excitation, Fluids, Turbulence, Lift (Fluid dynamics), Random excitation, Computer simulation, Boilers, Flow-induced vibrations, Reliability, Spectra (Spectroscopy)
Proceedings Papers

Coupled Analysis Approach in OTEC System Design

Shan Shi, John Halkyard, Nishu Kurup, Lei Jiang
Proc. ASME. OMAE2012, Volume 4: Offshore Geotechnics; Ronald W. Yeung Honoring Symposium on Offshore and Ship Hydrodynamics, 795-802, July 1–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2012-83978
https://doi.org/10.1115/OMAE2012-83978
View Paper titled, Coupled Analysis Approach in OTEC System Design
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Topics: Design, Ocean thermal energy conversion, Water, Water pipes, Heat exchangers, Ocean engineering, Temperature, Deep ocean water, Dynamic models, Fluids
Journal Articles

Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020907.
https://doi.org/10.1115/1.4006707
Published Online: June 11, 2012
View Article titled, Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects
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Topics: Diffusion (Physics), Electrodiffusion, Solder joints, Solders, Stress, Flip-chip, Finite element analysis, Grain boundary diffusion, Electric potential, Surface energy
Proceedings Papers

Numerical Simulations of Electromigration and Stress Migration Driven Void Propagation in Pb Free Solder Interconnects

Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 585-590, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52230
https://doi.org/10.1115/IPACK2011-52230
View Paper titled, Numerical Simulations of Electromigration and Stress Migration Driven Void Propagation in Pb Free Solder Interconnects
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Topics: Computer simulation, Electrodiffusion, Lead-free solders, Stress, Finite element analysis, Flip-chip, Solder joints, Accounting, Diffusion (Physics), Electric potential
Proceedings Papers

Study of Nonlinear Internal Waves and Impact on Offshore Drilling Units

Nishu V. Kurup, Shan Shi, Zhongmin Shi, Wenju Miao, Lei Jiang
Proc. ASME. OMAE2011, Volume 1: Offshore Technology; Polar and Arctic Sciences and Technology, 831-840, June 19–24, 2011
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2011-50304
https://doi.org/10.1115/OMAE2011-50304
View Paper titled, Study of Nonlinear Internal Waves and Impact on Offshore Drilling Units
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Topics: Underwater drilling, Waves, Drilling, Seas, Pipeline risers, China, Computer simulation, Ocean engineering, Physics, Currents
Proceedings Papers

Air Bubble Bursting Effect of Lotus Leaf

Jingming Wang, Yongmei Zheng, Fu-Qiang Nie, Jin Zhai, Lei Jiang
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2, 667-674, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18240
https://doi.org/10.1115/MNHMT2009-18240
View Paper titled, Air Bubble Bursting Effect of Lotus Leaf
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Topics: Bubbles, Nanostructures , Surface roughness
Proceedings Papers

A Paradigm Shift in the Development of Chemical Mechanical Polishing (CMP): Cost-Effective CMP Planarization in Next Generation Substrate/Package Design and Manufacturing

Stefanie Lotz, Robert Baresel, Dipto Thakurta, Lei Jiang, Tuhin Ghosh
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1031-1036, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73371
https://doi.org/10.1115/IPACK2005-73371
View Paper titled, A Paradigm Shift in the Development of Chemical Mechanical Polishing (CMP): Cost-Effective CMP Planarization in Next Generation Substrate/Package Design and Manufacturing
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Topics: Design, Manufacturing, Polishing, Slurries, Copper, Recycling, Computer-aided design, Data collection, Density, Electroplating