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Lauren Boteler
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Journal Articles

A System to Package Perspective on Transient Thermal Management of Electronics

H. Peter de Bock, David Huitink, Patrick Shamberger, James Spencer Lundh, Sukwon Choi, Nicholas Niedbalski, Lauren Boteler
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041111.
Paper No: EP-20-1028
DOI: https://doi.org/10.1115/1.4047474
Published Online: June 29, 2020
View Article titled, A System to Package Perspective on Transient Thermal Management of Electronics
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Topics: Transients (Dynamics), Thermal management, Design, Phase change materials, Temperature, Heat
Proceedings Papers

Advanced Packaging and Thermal Management of High-Power DC-DC Converters

Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi, Shiladri Chakraborty, Yongwan Park, He Yun, Alireza Khaligh, Lauren Boteler, Miguel Hinojosa
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A026, October 7–9, 2019
Paper No: IPACK2019-6559
DOI: https://doi.org/10.1115/IPACK2019-6559
View Paper titled, Advanced Packaging and Thermal Management of High-Power DC-DC Converters
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Topics: Electronics, Packaging, Packaging density (Electronics), Thermal management
Journal Articles

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
DOI: https://doi.org/10.1115/1.4043406
Published Online: May 8, 2019
View Article titled, Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
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Topics: Cooling, Flow (Dynamics), Heat, Heat sinks, Temperature, Geometry, Coolants, Fins, Silicon, Electronic packages
Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. September 2019, 141(3): 030301.
Paper No: EP-19-1036
DOI: https://doi.org/10.1115/1.4043484
Published Online: May 8, 2019
View Article titled, Special Issue on InterPACK 2018
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Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers
Proceedings Papers

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Marco J. Echeverría, Pedro O. Quintero, Dimeji Ibitayo, Lauren Boteler
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 27–30, 2018
Paper No: IPACK2018-8279
DOI: https://doi.org/10.1115/IPACK2018-8279
View Paper titled, Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging
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Topics: Ceramics, Electronic packaging, Sprays, Copper, Manufacturing, Reliability, Aluminum, Bonding, Brittleness, Computer simulation
Proceedings Papers

Multifunctional Chip for Use in Thermal Analysis of Power Systems

David Gonzalez-Nino, Lauren Boteler, Damian P. Urciuoli, Iain M. Kierzewski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 27–30, 2018
Paper No: IPACK2018-8355
DOI: https://doi.org/10.1115/IPACK2018-8355
View Paper titled, Multifunctional Chip for Use in Thermal Analysis of Power Systems
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Topics: Design, Electronic systems, Flux (Metallurgy), Heat, Heat flux, High temperature, Instrumentation, Junctions, Military systems, Power systems (Machinery)
Proceedings Papers

3D Thermal Resistance Network Method for the Design of Highly Integrated Packages

Lauren Boteler, Andrew Smith
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A009, July 14–19, 2013
Paper No: HT2013-17575
DOI: https://doi.org/10.1115/HT2013-17575
View Paper titled, 3D Thermal Resistance Network Method for the Design of Highly Integrated Packages
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Topics: Design, Thermal resistance, Packaging, Resistors, Temperature, Cooling, Dimensions, Electronics, Computer simulation, Energy dissipation
Proceedings Papers

Interfacial Resistance Measurement of High Performance Thermal Interface Materials

Andrew N. Smith, Nicholas Jankowski, Lauren Boteler, Christopher Meyer
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A003, July 14–19, 2013
Paper No: HT2013-17507
DOI: https://doi.org/10.1115/HT2013-17507
View Paper titled, Interfacial Resistance Measurement of High Performance Thermal Interface Materials
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Topics: Interfacial thermal resistance, Temperature, ASTM International, Resolution (Optics), Heat, Uncertainty, Microscopes, Preforms, Probes, Resistance thermometers
Proceedings Papers

A Micromachined Manifold Microchannel Cooler

Lauren Boteler, Nicholas Jankowski, Bruce Geil, Patrick McCluskey
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 61-68, November 13–19, 2009
Paper No: IMECE2009-11780
DOI: https://doi.org/10.1115/IMECE2009-11780
View Paper titled, A Micromachined Manifold Microchannel Cooler
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Topics: Manifolds, Microchannels, Micromachining, Aluminum, Pressure drop, Silicon, Heat, Temperature uniformity, Cooling, Design