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Kai Goebel
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Proceedings Papers

Feature Selection for Tool Wear Diagnosis Using Soft Computing Techniques

Kai Goebel, Weizhong Yan
Proc. ASME. IMECE2000, Manufacturing Engineering, 157-163, November 5–10, 2000
Paper No: IMECE2000-1803
DOI: https://doi.org/10.1115/IMECE2000-1803
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Topics: Feature extraction, Feature selection, Sensors, Wear
Proceedings Papers

Temporal Fault Injection Considerations in Resilience Quantification

Daniel Hulse, Christopher Hoyle, Irem Y. Tumer, Kai Goebel, Chetan Kulkarni
Proc. ASME. IDETC-CIE2020, Volume 11A: 46th Design Automation Conference (DAC), V11AT11A040, August 17–19, 2020
Paper No: DETC2020-22154
DOI: https://doi.org/10.1115/DETC2020-22154
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Topics: Resilience, Errors, Design, Approximation, Dynamic models, Engineering simulation, Robustness, Simulation
Journal Articles

Remaining Useful Life Prediction of Bearings Using Ensemble Learning: The Impact of Diversity in Base Learners and Features

Junchuan Shi, Tianyu Yu, Kai Goebel, Dazhong Wu
Journal: Journal of Computing and Information Science in Engineering
Article Type: Research Papers
J. Comput. Inf. Sci. Eng. April 2021, 21(2): 021004.
Paper No: JCISE-20-1129
DOI: https://doi.org/10.1115/1.4048215
Published Online: October 13, 2020
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Topics: Algorithms, Bearings, Errors, Service life (Equipment), Feature selection, Vibration, Signals, Failure
Journal Articles

How Uncertain Is Too Uncertain? Validity Tests for Early Resilient and Risk-Based Design Processes

Daniel Hulse, Christopher Hoyle, Irem Y. Tumer, Kai Goebel
Journal: Journal of Mechanical Design
Article Type: Research Papers
J. Mech. Des. January 2021, 143(1): 011702.
Paper No: MD-20-1028
DOI: https://doi.org/10.1115/1.4047346
Published Online: July 24, 2020
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Topics: Design, Uncertainty, Risk, Resilience
Includes: Supplementary data
Journal Articles

A Novel Model-Based Framework for Power Consumption Prognosis in Multirotors Applied to the Battery End of Discharge Prognostics

Gina Sierra, Kai Goebel
Journal: Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems
Article Type: Research Papers
ASME J Nondestructive Evaluation. May 2020, 3(2): 021006.
Paper No: NDE-19-1043
DOI: https://doi.org/10.1115/1.4046611
Published Online: March 25, 2020
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Topics: Batteries, Energy consumption, Weight (Mass), Flight, Thrust, Vehicles, Wind
Proceedings Papers

Decomposing Incentives for Early Resilient Design: Method and Validation

Daniel Hulse, Christopher Hoyle, Irem Y. Tumer, Kai Goebel
Proc. ASME. IDETC-CIE2019, Volume 2B: 45th Design Automation Conference, V02BT03A015, August 18–21, 2019
Paper No: DETC2019-97466
DOI: https://doi.org/10.1115/DETC2019-97466
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Topics: Resilience, Design, Uncertainty, Risk, Engineering design processes, Failure, Optimization, Power systems (Machinery), Redundancy (Engineering), Risk analysis
Journal Articles

Quantifying the Resilience-Informed Scenario Cost Sum: A Value-Driven Design Approach for Functional Hazard Assessment

Daniel Hulse, Christopher Hoyle, Kai Goebel, Irem Y. Tumer
Journal: Journal of Mechanical Design
Article Type: Research-Article
J. Mech. Des. February 2019, 141(2): 021403.
Paper No: MD-18-1503
DOI: https://doi.org/10.1115/1.4041571
Published Online: December 20, 2018
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Topics: Design, Failure, Resilience, Optimization, Flow (Dynamics), Simulation
Journal Articles

Degradation Modeling and Remaining Useful Life Prediction of Aircraft Engines Using Ensemble Learning

Zhixiong Li, Kai Goebel, Dazhong Wu
Journal: Journal of Engineering for Gas Turbines and Power
Article Type: Research-Article
J. Eng. Gas Turbines Power. April 2019, 141(4): 041008.
Paper No: GTP-18-1207
DOI: https://doi.org/10.1115/1.4041674
Published Online: November 16, 2018
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Topics: Aircraft engines, Algorithms, Feature selection, Modeling, Particle swarm optimization, Service life (Equipment), Optimization, Weight (Mass)
Proceedings Papers

Optimizing Function-Based Fault Propagation Model Resilience Using Expected Cost Scoring

Daniel Hulse, Christopher Hoyle, Kai Goebel, Irem Y. Tumer
Proc. ASME. IDETC-CIE2018, Volume 2A: 44th Design Automation Conference, V02AT03A052, August 26–29, 2018
Paper No: DETC2018-85318
DOI: https://doi.org/10.1115/DETC2018-85318
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Topics: Resilience, Design, Optimization, Risk, Evolutionary algorithms, Failure, Flow (Dynamics), Simulation, Tradeoffs
Proceedings Papers

Model Validation in Early Phase of Designing Complex Engineered Systems

Elham Keshavarzi, Kai Goebel, Irem Y. Tumer, Christopher Hoyle
Proc. ASME. IDETC-CIE2018, Volume 2A: 44th Design Automation Conference, V02AT03A059, August 26–29, 2018
Paper No: DETC2018-85137
DOI: https://doi.org/10.1115/DETC2018-85137
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Topics: Design, Model validation, Simulation, Failure, Failure mode and effects analysis, Manufacturing, Propulsion systems, Sensitivity analysis
Proceedings Papers

Resilient System Design Using Cost-Risk Analysis With Functional Models

Elham Keshavarzi, Matthew McIntire, Kai Goebel, Irem Y. Tumer, Christopher Hoyle
Proc. ASME. IDETC-CIE2017, Volume 2A: 43rd Design Automation Conference, V02AT03A043, August 6–9, 2017
Paper No: DETC2017-67952
DOI: https://doi.org/10.1115/DETC2017-67952
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Topics: Design, Risk, Failure, Resilience, Conceptual design, Preferences, Probability, Propellants
Proceedings Papers

Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators

Pradeep Lall, Kazi Mirza, Mahendra Harsha, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A025, July 16–18, 2013
Paper No: IPACK2013-73309
DOI: https://doi.org/10.1115/IPACK2013-73309
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Topics: Electronics, Reliability, Storage, Damage, Temperature, Avionics, Electronic systems, Failure, High temperature, Intermetallic compounds
Proceedings Papers

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability

Pradeep Lall, Ryan Lowe, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A019, July 16–18, 2013
Paper No: IPACK2013-73252
DOI: https://doi.org/10.1115/IPACK2013-73252
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Topics: Algorithms, Reliability, Kalman filters, Ball-Grid-Array packaging, Failure, Filters, Particulate matter, Printed circuit boards, Service life (Equipment), Solder joints
Proceedings Papers

Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics

Pradeep Lall, Mahendra Harsha, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A014, July 16–18, 2013
Paper No: IPACK2013-73251
DOI: https://doi.org/10.1115/IPACK2013-73251
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Topics: Damage, Electronics, Cycles, Failure, Alloys, Elastic moduli, Electronic systems, Errors, High temperature, Reliability
Proceedings Papers

Cost Assessment for Implementation of Embedded Prognostic Health Management for Electronic Systems

Pradeep Lall, Ryan Lowe, Kai Goebel
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 775-785, November 9–15, 2012
Paper No: IMECE2012-93058
DOI: https://doi.org/10.1115/IMECE2012-93058
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Topics: Aerospace industry, Automotive industry, Decision making, Defense industry, Economic analysis, Electrical components, Electronic systems, Electronics, Engineering disciplines, Engineers
Proceedings Papers

Failure Mode Clustering is Electronic Assemblies Using Sammon’s Mapping With Supervised Training of Perceptrons

Pradeep Lall, Prashant Gupta, Kai Goebel
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 911-925, November 11–17, 2011
Paper No: IMECE2011-65833
DOI: https://doi.org/10.1115/IMECE2011-65833
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Topics: Failure mechanisms, Failure, Artificial neural networks, Damage, Fracture (Process), Shock (Mechanics), Solders, Vibration, Cross section (Physics), Errors
Proceedings Papers

PHM of Leadfree Electronic Assemblies Using Resistance Spectroscopy With Sequential Importance Resampling

Pradeep Lall, Ryan Lowe, Kai Goebel
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 973-986, November 11–17, 2011
Paper No: IMECE2011-65832
DOI: https://doi.org/10.1115/IMECE2011-65832
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Topics: Spectroscopy, Damage, Failure, Service life (Equipment), Algorithms, Electronics, Filters, Particulate matter, Reliability, Electronic components
Proceedings Papers

Accrued Damage and Remaining Life in Field Extracted Assemblies Under Sequential Thermo-Mechanical Loads

Pradeep Lall, Mahendra Harsha, Jeff Suhling, Kai Goebel, Jim Jones
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 989-1004, November 11–17, 2011
Paper No: IMECE2011-65834
DOI: https://doi.org/10.1115/IMECE2011-65834
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Topics: Damage, Stress, Thermomechanics, Failure, Errors, Service life (Equipment), Electronics, Delamination, Electronic systems, Fracture (Materials)
Journal Articles

Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact

Pradeep Lall, Ryan Lowe, Kai Goebel
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021001.
DOI: https://doi.org/10.1115/1.4006706
Published Online: June 11, 2012
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Topics: Damage, Electronics, Failure, Shock (Mechanics), Solders, Spectroscopy, Vibration, Signals, Phase shift, Stress
Proceedings Papers

Prognostic Health Monitoring of Damage Progression in Leadfree Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling

Pradeep Lall, Rahul Vaidya, Vikrant More, Kai Goebel
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 289-302, November 12–18, 2010
Paper No: IMECE2010-40668
DOI: https://doi.org/10.1115/IMECE2010-40668
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Topics: Damage, Electronics, Failure, Electronic systems, Errors, Reliability, Stress, Thermomechanics, Cycles, Storage