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K. Srihari
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Proceedings Papers

Parametric Studies of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sandeep S. Tonapi, Sanjeev B. Sathe, K. Srihari, Bahgat B. Sammakia
Proc. ASME. IMECE2000, Manufacturing Engineering, 425-431, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1837
https://doi.org/10.1115/IMECE2000-1837
View Paper titled, Parametric Studies of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
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Topics: Ball-Grid-Array packaging, Heat transfer, Accounting, Convection, Energy dissipation, Forced convection, Heat, Heat conduction, Junctions, Temperature
Journal Articles

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

P. Tumne, V. Venkatadri, S. Kudtarkar, M. Delaus, D. Santos, R. Havens, K. Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020905.
https://doi.org/10.1115/1.4005906
Published Online: June 11, 2012
View Article titled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages
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Topics: Alloys, Design, Failure, Failure mechanisms, Intermetallic compounds, Reliability, Semiconductor wafers, Solders, Separation (Technology), Shock (Mechanics)
Proceedings Papers

Evaluation of a Stacked Package Utilizing LGA Devices

G. Srinivasan, S. Iyer, R. Havens, K. Srihari
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 303-308, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40899
https://doi.org/10.1115/IMECE2010-40899
View Paper titled, Evaluation of a Stacked Package Utilizing LGA Devices
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Cycles, Density, Failure, Failure analysis, Lead-free solders, Manufacturing, Printed circuit boards, Reliability
Proceedings Papers

Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes

G. Srinivasan, R. Murcko, K. Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 283-292, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89241
https://doi.org/10.1115/InterPACK2009-89241
View Paper titled, Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes
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Topics: Finishes, Plating, Wire, Nickel, Palladium, Silver, Failure analysis, High temperature, Manufacturing, Reliability
Proceedings Papers

Assessment of 20 Micrometer Diameter Wires for Wire Bond Interconnect Technology

S. Saiyed, S. A. Kudtarkar, R. Murcko, K. Srihari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 923-930, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33691
https://doi.org/10.1115/IPACK2007-33691
View Paper titled, Assessment of 20 Micrometer Diameter Wires for Wire Bond Interconnect Technology
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Topics: Wire, Bonding, Reliability, High temperature, Stress, Aluminum, Bond strength, Catalysts, Mechanical testing, Shear (Mechanics)
Proceedings Papers

To Study the High Temperature Effects on Ball Bonds Using Low K Material in Wire Bond Devices

S. A. Kudtarkar, R. Murcko, K. Srihari, S. Saiyed
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 169-175, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43765
https://doi.org/10.1115/IMECE2007-43765
View Paper titled, To Study the High Temperature Effects on Ball Bonds Using Low K Material in Wire Bond Devices
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Topics: High temperature, Wire, Reliability, Stress, Wire bonding, Aluminum, Copper, Delays, Heat, Materials properties
Proceedings Papers

Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities

Arun Gowda, Annita Zhong, Sandeep Tonapi, Kaustubh Nagarkar, K. Srihari
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1911-1918, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73490
https://doi.org/10.1115/IPACK2005-73490
View Paper titled, Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities
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Topics: Mechanical properties, Silicones, Heat, Adhesives, Fillers (Materials), Flat heat pipes, Microelectronic devices, Phase change materials, Pumps, Resins
Proceedings Papers

Passive Optoelectronics Component Manufacturing: A Case Study

Laurence A. Harvilchuck, Peter Borgesen, Pericles Kondos, Sunil Gopakumar, K. Srihari
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 465-469, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39208
https://doi.org/10.1115/IMECE2002-39208
View Paper titled, Passive Optoelectronics Component Manufacturing: A Case Study
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Topics: Manufacturing, Optoelectronic devices
Proceedings Papers

Lead-Free Flip Chip Assembly

Sunil Gopakumar, Vinodh Poyyapakkam, Dan Blass, Peter Borgesen, K. Srihari
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 105-109, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39251
https://doi.org/10.1115/IMECE2002-39251
View Paper titled, Lead-Free Flip Chip Assembly
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Topics: Alloys, Collapse, Copper, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flux (Metallurgy), Manufacturing, Soldering, Solders
Proceedings Papers

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

Muthiah Venkateswaran, Peter Borgesen, K. Srihari
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 111-115, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39252
https://doi.org/10.1115/IMECE2002-39252
View Paper titled, Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly
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Topics: Adhesives, Flip-chip assemblies
Proceedings Papers

Splice Loss Optimization of Single Mode Fiber and Erbium Doped Fiber—Experiments and Issues

Salil Pradhan, John Arbulich, K. Srihari
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 479-486, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42152
https://doi.org/10.1115/IMECE2003-42152
View Paper titled, Splice Loss Optimization of Single Mode Fiber and Erbium Doped Fiber—Experiments and Issues
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Topics: Fibers, Optimization, Wavelength, Absorption, Manufacturing, Atoms, Creep, Experimental design, Lasers, Noise (Sound)
Proceedings Papers

Study of Alternate Surface Finishes for Quad Flat Packs

Muffadal Mukadam, Michael Meilunas, K. Srihari
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 495-503, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42846
https://doi.org/10.1115/IMECE2003-42846
View Paper titled, Study of Alternate Surface Finishes for Quad Flat Packs
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Topics: Finishes, Solder joints, Steam, Fracture (Materials), Fracture (Process), Manufacturing, Optical quality control, Solders, Wetting, X-rays
Proceedings Papers

Site Redressing Techniques and Rework of Lead-Free Chip Scale Packages

Arun Gowda, Anthony Primavera, K. Srihari
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 523-531, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-55637
https://doi.org/10.1115/IMECE2003-55637
View Paper titled, Site Redressing Techniques and Rework of Lead-Free Chip Scale Packages
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Topics: Cycles, Electronics, Lead-free solders, Manufacturing, Printed circuit boards, Solders, Temperature
Proceedings Papers

Testability of Erbium Doped Fiber Amplifiers: An Approach Towards Yield Improvement

Salil Pradhan, John Arbulich, Purushothaman Damodaran, K. Srihari
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 363-370, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59280
https://doi.org/10.1115/IMECE2004-59280
View Paper titled, Testability of Erbium Doped Fiber Amplifiers: An Approach Towards Yield Improvement
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Topics: Fibers, Manufacturing, Temperature, Corrective actions, Cycles, Electronics, Failure, Failure mechanisms, Noise (Sound), Optoelectronic devices
Proceedings Papers

An Yield Model for Electronics Assembly

N. Gnanasambandam, M. Munikrishnan, V. Poyyapakkam, P. Borgesen, K. Srihari
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 375-380, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82623
https://doi.org/10.1115/IMECE2005-82623
View Paper titled, An Yield Model for Electronics Assembly
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Topics: Electronics, Manufacturing, Modeling, Ball-Grid-Array packaging, Density, Design, Electronic components, Flip-chip, Flip-chip devices, Microelectronic devices
Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
https://doi.org/10.1115/1.2188952
Published Online: February 14, 2006
View Article titled, Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems
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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon
Journal Articles

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Sandeep S. Tonapi, Sanjeev B. Sathe, Bahgat G. Sammakia, K. Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 305–310.
https://doi.org/10.1115/1.2351891
Published Online: February 10, 2006
View Article titled, A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages
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Topics: Air flow, Ball-Grid-Array packages, Energy dissipation, Forced convection, Heat, Heat transfer, Numerical analysis, Temperature, Junctions, Temperature distribution
Journal Articles

Optimization Study for a Parallel Plate Impingement Heat Sink

Amit Shah, Bahgat G. Sammakia, K. Srihari, K. Ramakrishna
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 311–318.
https://doi.org/10.1115/1.2351893
Published Online: February 6, 2006
View Article titled, Optimization Study for a Parallel Plate Impingement Heat Sink
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Topics: Design, Heat sinks, Fins, Pressure drop, Optimization
Journal Articles

A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

Yu-Wen Huang, K. Srihari, Jim Adriance, George Westby
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 282–289.
https://doi.org/10.1115/1.2905699
Published Online: December 1, 1994
View Article titled, A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem
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Topics: Surface mount packaging, Engineering prototypes, Lumber, Machinery, Manufacturing, Nozzles, Printed circuit boards, Surface mount components, Tooling