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Gary F. Goth
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Journal Articles
Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020906.
Published Online: June 11, 2012
Proceedings Papers
Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 221-229, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52130