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Fumiaki Yamada
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Proceedings Papers

Development of the Severe Accident Evaluation Method on Second Coolant Leakages From the PHTS in a Loop-Type Sodium-Cooled Fast Reactor

Fumiaki Yamada, Yuya Imaizumi, Masahiro Nishimura, Yoshitaka Fukano, Mitsuhiro Arikawa
Proc. ASME. ICONE25, Volume 5: Advanced and Next Generation Reactors, Fusion Technology; Codes, Standards, Conformity Assessment, Licensing, and Regulatory Issues, V005T05A049, July 2–6, 2017
Publisher: American Society of Mechanical Engineers
Paper No: ICONE25-67581
https://doi.org/10.1115/ICONE25-67581
View Paper titled, Development of the Severe Accident Evaluation Method on Second Coolant Leakages From the PHTS in a Loop-Type Sodium-Cooled Fast Reactor
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Topics: Accidents, Coolants, Evaluation methods, Leakage, Sodium fast reactors, Sodium, Countermeasures, Heat, Reactor vessels, Transients (Dynamics)
Proceedings Papers

Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73151
https://doi.org/10.1115/IPACK2013-73151
View Paper titled, Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP
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Topics: Silicon chips, Simulation, Thermal stresses, Stress, Bending strength, Copper, Finite element methods, Yield stress, Brittleness, Elevations (Drawings)
Journal Articles

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020903.
https://doi.org/10.1115/1.4006515
Published Online: June 11, 2012
View Article titled, Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package
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Topics: Finite element methods, Silicon, Silicon chips, Simulation, Stress, System-in-package, Thermal stresses, Temperature, Stress concentration
Proceedings Papers

Thermal Stress of Through Silicon Vias and Si Chips in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 325-328, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52241
https://doi.org/10.1115/IPACK2011-52241
View Paper titled, Thermal Stress of Through Silicon Vias and Si Chips in 3D SiP
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Topics: Silicon, Silicon chips, Thermal stresses, Stress, Copper, Crystals, Damage, Reliability, Yield stress, Cycles
Proceedings Papers

Numerical Simulation of Monju Plant Dynamics by Super-COPD Using Previous Startup Tests Data

Fumiaki Yamada, Hiroaki Ohira
Proc. ASME. FEDSM2010, ASME 2010 3rd Joint US-European Fluids Engineering Summer Meeting: Volume 1, Symposia – Parts A, B, and C, 1951-1958, August 1–5, 2010
Publisher: American Society of Mechanical Engineers
Paper No: FEDSM-ICNMM2010-30287
https://doi.org/10.1115/FEDSM-ICNMM2010-30287
View Paper titled, Numerical Simulation of Monju Plant Dynamics by Super-COPD Using Previous Startup Tests Data
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Topics: Computer simulation, Dynamics (Mechanics), Flow (Dynamics), Network models, Transients (Dynamics), Heat exchangers, Reactor vessels, Waste heat
Proceedings Papers

Human Reliability and the Current Dilemma in Human-Machine Interface Design Strategies

Roberto Passalacqua, Fumiaki Yamada
Proc. ASME. ICONE10, 10th International Conference on Nuclear Engineering, Volume 2, 71-79, April 14–18, 2002
Publisher: American Society of Mechanical Engineers
Paper No: ICONE10-22061
https://doi.org/10.1115/ICONE10-22061
View Paper titled, Human Reliability and the Current Dilemma in Human-Machine Interface Design Strategies
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Topics: Design, Machinery, Reliability, Decision making, Errors, Maintenance, Risk, Safety, Accidents, Aircraft
Proceedings Papers

Realistic Safety Margin Analysis of “MONJU” Based on Plant Performance Measurements

Fumiaki Yamada, Kenji Kitamura
Proc. ASME. ICONE12, 12th International Conference on Nuclear Engineering, Volume 3, 185-190, April 25–29, 2004
Publisher: American Society of Mechanical Engineers
Paper No: ICONE12-49381
https://doi.org/10.1115/ICONE12-49381
View Paper titled, Realistic Safety Margin Analysis of “MONJU” Based on Plant Performance Measurements
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Topics: Accidents, Safety
Proceedings Papers

Margin Analysis of MONJU Thermal Transient Based on Measured Plant Performance

Takero Mori, Fumiaki Yamada
Proc. ASME. ICONE14, Volume 2: Thermal Hydraulics, 367-374, July 17–20, 2006
Publisher: American Society of Mechanical Engineers
Paper No: ICONE14-89379
https://doi.org/10.1115/ICONE14-89379
View Paper titled, Margin Analysis of MONJU Thermal Transient Based on Measured Plant Performance
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Topics: Transients (Dynamics), Design, Breeder reactors, Electric power generation, Engineering prototypes, Feedwater, Heat exchangers, Nozzles, Reactor vessels, Safety