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David Lee Butler
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Journal Articles

A Numerical and Experimental Study of Distribution of the Residual Stress on the Shot Peened Low Alloy Steel

Pham Quang Trung, David Lee Butler, Sridhar Idapalapati
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. October 2018, 140(4): 041006.
Paper No: MATS-17-1288
https://doi.org/10.1115/1.4040004
Published Online: May 24, 2018
View Article titled, A Numerical and Experimental Study of Distribution of the Residual Stress on the Shot Peened Low Alloy Steel
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Topics: Pressure, Shot peening, Residual stresses, Stress, Finite element model, Compressive stress, Fatigue life
Journal Articles

Effect of Shot Peening Process on the Fatigue Life of Shot Peened Low Alloy Steel

Pham Quang Trung, Nay Win Khun, David Lee Butler
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. January 2018, 140(1): 011013.
Paper No: MATS-16-1325
https://doi.org/10.1115/1.4037525
Published Online: September 13, 2017
View Article titled, Effect of Shot Peening Process on the Fatigue Life of Shot Peened Low Alloy Steel
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Topics: Alloy steel, Fatigue life, Fatigue testing, Fracture (Materials), Shot peening, Fatigue, Surface roughness, Stress
Proceedings Papers

A Methodology to Reduce the Wafer to Wafer Thickness Variation in Chemical Mechanical Planarization (CMP)

Sim Kit Wang, David Lee Butler
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 507-508, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64194
https://doi.org/10.1115/WTC2005-64194
View Paper titled, A Methodology to Reduce the Wafer to Wafer Thickness Variation in Chemical Mechanical Planarization (CMP)
Open the PDF for A Methodology to Reduce the Wafer to Wafer Thickness Variation in Chemical Mechanical Planarization (CMP) in another window
Topics: Semiconductor wafers, Film thickness, Flow (Dynamics), Contact mechanics, Integrated circuit fabrication, Pressure, Slurries