In the present work, it is shown that friction can be used to deposit diamond in a substrate of copper. Here it was found through electronic scan microscopy that a composite material film that varies from 27 to 30 microns depth can be formed. This film has particles from 10 to 1 microns and the concentration of diamond decreases with depth. A change on the crystalline structure caused by temperatures closer to the melting point achieved by the process was also found.
Deposition of Diamond in Copper by Triboadhesion
Contributed by the Manufacturing Engineering Division for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received May 2001; Revised August 2002. Associate Editor: S. Kapoor
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Rodrı´guez Lelis , J. M., Colı´n Ocempo , J., Porcayo Caldero´n , J., and Robles , J. M. (July 23, 2003). "Deposition of Diamond in Copper by Triboadhesion ." ASME. J. Manuf. Sci. Eng. August 2003; 125(3): 628–630. https://doi.org/10.1115/1.1557297
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