An investigation is reported of the mechanisms and associated energy for grinding of ceramics. SEM observations of grinding debris indicate material removal mainly by brittle fracture. However, microscopic examination of the ground surfaces reveals extensive ductile flow with characteristic plowed grooves along the grinding direction. From an order of magnitude analysis it is shown that the energy expended by brittle fracture can comprise only a negligible portion of the total. Virtually all of the grinding energy is attributed to ductile flow by plowing. For a number of ceramic materials ground over a wide range of conditions, the grinding power is found to be nearly proportional to the rate o plowed groove area generated, which suggests a constant energy per unit area of plowed surface Js. Values obtained for Js are much bigger than the corresponding fracture surface energies and proportional to Kc3/2H.

1.
Kovach, J. A., Blau, P. J., Malkin, S., Srinivasan, S., Bandyopadhyay, B., and Ziegler, K., 1993, “A Feasibility Investigation of High Speed, Low Damage Grinding Process for Advanced Ceramics,” 5th International Grinding Conf., Vol. I, SME.
2.
Malkin
S.
, and
Ritter
J. E.
,
1989
, “
Grinding Mechanism and Strength Degradation for Ceramics
,”
ASME JOURNAL OF ENGINEERING FOR INDUSTRY
, Vol.
111
, pp.
167
173
.
3.
Malkin
S.
, and
Hwang
T. W.
,
1996
, “
Grinding Mechanisms for Ceramics
,”
Annals of the CIRP
, Vol.
45
, No.
2
, pp.
569
580
.
4.
Malkin, S., 1989, Grinding Technology: Theory and Application of Machining with Abrasives, John Wiley & Sons, New York. Reprinted by SME.
5.
Spur, G., Stark, C., and Tio, T. H., 1985, “Grinding of Non-Oxide Ceramics Using Diamond Grinding Wheels,” Machining of Ceramic Materials and Components, Subramanian, K., and Komanduri, R., eds., PED-Vol. 17, ASME, p. 33.
6.
Subramanian, K., and Keat, P. P., 1985, “Parametric Study on Grindability of Structural and Electronic Ceramics-Part I,” Machining of Ceramic Materials and Components, Subramanian, K., and Komanduri, R., eds., PED-Vol. 17, ASME, p. 25.
7.
Inasaki
I.
, and
Nakayama
K.
,
1986
, “
High-Efficiency Grinding of Advanced Ceramics
,”
Annals of the CIRP
, Vol.
35
, No.
1
, pp.
211
214
.
8.
Chen, C., Jung, Y., and Inasaki, I., 1989, “Surface, Cylindrical and Internal Grinding of Advanced Ceramics,” Grinding Fundamentals and Applications, Malkin, S. and Kovach, J. A., eds., PED-Vol. 39, ASME, pp. 201–211.
9.
Kitajima
K.
,
Kai
G. Q.
,
Kumagai
N.
,
Tanaka
Y.
, and
Zheng
H. W.
,
1992
, “
Study on Mechanism of Ceramics Grinding
,”
Annals of the CIRP
, Vol.
41
, No.
1
, pp.
367
371
.
10.
Roth, P., and To¨nshoff, H. K., 1993, “Influence of Microstructure on Grindability of Alumina Ceramics,” NIST SP 847, pp. 247–261.
11.
Zhang
L. C.
,
1994
, “
Grindability of Some Metallic and Ceramic Materials in CFG Regimes
,”
Int. J. Mach. Tools Manufact.
, Vol.
34
, No.
8
, pp.
1045
1057
.
12.
Lawn
B. R.
, and
Evans
A. G.
,
1980
, “
Elastic/Plastic Indentation Damage in Ceramics: The Median/Radial Crack System
,”
J. Amer. Ceram. Soc.
, Vol.
63
, pp.
574
581
.
13.
Jahanmir, S., 1994, Friction and Wear of Ceramics, Marcel Dekker, Inc., New York.
14.
Mayer, J. E., Jr., and Fang, G. P., 1993, “Diamond Grinding of Silicon Nitride,” NIST SP 847, pp. 205–222.
15.
Imanaka, A., Fujino, S., and Maneta, S., 1972, “Direct Observation of Material Removal Process During Grinding of Ceramics by Micro-Flash Technique,” The Science of Ceramic Machining and Surface Finishing, NBS Special Pub. 348, p. 37.
16.
Huerta, M., and Malkin, S., 1976, “Grinding of Glass: The Mechanics of the Process,” ASME JOURNAL OF ENGINEERING FOR INDUSTRY, pp. 459–467.
17.
Huerta, M., and Malkin, S., 1976, “Grinding of Glass: Surface Structure and Fracture Strength,” ASME JOURNAL OF ENGINEERING FOR INDUSTRY, pp. 468–473.
18.
Pai
D. M.
,
Ratterman
E.
, and
Shaw
M. C.
,
1989
, “
Grinding Swarf
,”
Wear
, Vol.
131
, pp.
329
339
.
19.
Guiberteau
F.
,
Padture
N. P.
, and
Lawn
B. R.
,
1994
, “
Effect of Grain Size on Hertzian Contact Damage in Alumina
,”
J. Am. Ceram. Soc.
, Vol.
77
, pp.
1825
1831
.
20.
Xu
H. H. K.
,
Jahanmir
S.
, and
Ives
L. K.
,
1996
, “
Material Removal and Damage Formation Mechanisms in Grinding Silicon Nitride
,”
J. Mater. Res.
, Vol.
11
, pp.
1717
1724
.
21.
Singhal
S. C.
,
1976
, “
Effect of Water Vapor on the Oxidation of Hot Pressed Silicon Nitride and Silicon Carbide
,”
J. Am. Ceram. Soc
, Vol.
59
, pp.
81
82
.
22.
Zarudi, I., and Zhang, L. C, 1997, “Subsurface Structure Change of Silicon after Ultra-Precision Grinding,” Advances in Abrasive Technology, L. C. Zhang and N. Yasunaga, eds., World Scientific, Singapore, pp. 33–37.
23.
Evans
A. G.
, and
Wilshaw
T. R.
,
1976
, “
Quasi-Static Solid Particle Damage in Brittle Materials: I
,”
Acta Metall.
, Vol.
24
, pp.
939
956
.
24.
Evans, A. G., and Marshall, D. B., 1981, “Wear Mechanisms in Ceramics,” Fundamentals of Friction and Wear of Materials, Rigney, D. A., Ed., ASME, pp. 439–452.
25.
Koepke, B. G., and Stokes, R. J., 1979, “Effect of Workpiece Properties on Grinding Forces in Polycrystalline Ceramics,” The Science of Ceramic Machining and Surface Finishing II, Hockey, B. J., and Rice, R. W., Eds., NBS Special Publication, 562, pp. 75–91.
26.
Xu
H. H. K.
,
Jahanmir
S.
,
Ives
L. K.
, and
Ritchie
K. T.
,
1996
, “
Short-Crack Toughness and Abrasive Machining of Silicon Nitride
,”
J. Am. Ceram. Soc.
, Vol.
79
, pp.
3055
3064
.
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