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1-6 of 6
Keywords: thermoelectricity
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. April 2008, 130(4): 042410.
Published Online: March 19, 2008
.... The scheme is applied to study the thermal conductivity of silicon germanium (Si–Ge) nanocomposites, which are of great interest for high-efficiency thermoelectric material development. The Monte Carlo simulation was first validated by successfully reproducing the results of (two-dimensional) nanowire...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. January 2008, 130(1): 014502.
Published Online: January 28, 2008
...Y. Sungtaek Ju Pulsed thermoelectric cooling is an attractive approach for the site specific thermal management of infrared sensors and other low-heat flux devices. Intense Joule heating caused by electrical interface resistance, however, can severely degrade pulsed cooling performance. Numerical...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. July 2007, 129(7): 805–812.
Published Online: September 11, 2006
...Andrew Miner The compatibility of low-dimensional thermoelectric materials in forms such as thin films and nanowires for use in thermoelectric coolers is examined. First-order thermoelectric theory predicts that the cold and hot junction temperatures of a thermoelectric circuit are governed solely...
Journal Articles
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 76–84.
Published Online: February 15, 2005
... will provide an assessment of the potential for module cooling enhancement with thermoelectric coolers. A brief background discussion of thermoelectric cooling is provided citing some of the early history of thermoelectrics as well as more recent developments from the literature. An example analyzing cooling...
Journal Articles
Publisher: ASME
Article Type: Errata
J. Heat Mass Transfer. December 2003, 125(6): 1209.
Published Online: November 19, 2003
...Li Shi,; Deyu Li; Choongho Yu; Wanyoung Jang; Dohyung Kim; Zhen Yao; Philip Kim; Arunava Majumdar 19 11 2003 thermoelectricity nanostructured materials heat transfer nanotechnology thermal conductivity Seebeck effect silicon compounds membranes electrical conductivity heat...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. October 2003, 125(5): 881–888.
Published Online: September 23, 2003
.... However, below 100 K, a power law dependence of T 2.6 is observed, indicating a departure from the metallic behavior. These observations will be analyzed elsewhere. The thermoelectric figure of merit ( ZT ≡ S 2 / RG , where S , R , and G are Seebeck coefficient...