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Keywords: integrated circuits
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Journal Articles
Publisher: ASME
Article Type: Review Papers
J. Heat Mass Transfer. April 2002, 124(2): 223–241.
Published Online: December 7, 2001
... films, such as amorphous glasses and organic materials, the process-dependent material structure and stoichiometry influence the thermal conductivities and volumetric heat capacities. These films are common as passivation and thermal insulation in MEMS and integrated circuits. Silicon dioxide...