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Journal Articles

Foreword

Cristina Amon, Dereje Agonafer

Publisher: ASME

J. Heat Mass Transfer. January 2005, 127(1): 1.

https://doi.org/10.1115/1.1862670

Published Online: February 15, 2005

View Article titled, Foreword

Topics: Cooling, Heat conduction, Heat sinks, Heat transfer, Packaging, Thermal management, Computers, Computer cooling, Inventions, Design

Journal Articles

SHEAR LAYER INSTABILITY AND MIXING IN MICRO HEAT SPREADERS

C. Sert and, A. Beskok

Publisher: ASME

J. Heat Mass Transfer. August 2001, 123(4): 621.

https://doi.org/10.1115/1.1385892

Published Online: August 1, 2001

View Article titled, SHEAR LAYER INSTABILITY AND MIXING IN MICRO HEAT SPREADERS

Topics: Flat heat pipes, Flow instability, Packaging, Shear (Mechanics), Shear flow, Thermal management, Vortices

Journal Articles

Predictions of Turbulent Heat Transfer in an Axisymmetric Jet Impinging on a Heated Pedestal

S. Parneix, M. Behnia, P. A. Durbin

Publisher: ASME

J. Heat Mass Transfer. February 1999, 121(1): 43–49.

https://doi.org/10.1115/1.2825964

Published Online: February 1, 1999

View Article titled, Predictions of Turbulent Heat Transfer in an Axisymmetric Jet Impinging on a Heated Pedestal

Topics: Computers, Cooling, Electronic components, Engineering systems and industry applications, Flat plates, Geometry, Heat transfer coefficients, Heating, Jets, Modeling

Journal Articles

A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages

S. Sathe, B. Sammakia

Publisher: ASME

J. Heat Mass Transfer. November 1998, 120(4): 830–839.

https://doi.org/10.1115/1.2825902

Published Online: November 1, 1998

View Article titled, A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages

Topics: Electronic packages, Energy dissipation, Heat sinks, Accounting, Adhesives, Cooling, Electronics, Heat, Heat transfer, Manufacturing

Journal Articles

Thermal Contact Conductance of Spherical Rough Metals

M. A. Lambert, L. S. Fletcher

Publisher: ASME

J. Heat Mass Transfer. November 1997, 119(4): 684–690.

https://doi.org/10.1115/1.2824172

Published Online: November 1, 1997

View Article titled, Thermal Contact Conductance of Spherical Rough Metals

Topics: Contact resistance, Metals, Surface roughness, Junctions, Thermal conductivity, Cooling, Electrical conductance, Electronic packaging, Flight, Gas turbines

Journal Articles

Thermal Conductivity Measurements in Printed Wiring Boards

J. E. Graebner, K. Azar

Publisher: ASME

J. Heat Mass Transfer. August 1997, 119(3): 401–405.

https://doi.org/10.1115/1.2824111

Published Online: August 1, 1997

View Article titled, Thermal Conductivity Measurements in Printed Wiring Boards

Topics: Printed circuit boards, Thermal conductivity, Copper, Epoxy adhesives, Epoxy resins, Glass, Anisotropy, Lumber, Heat, Heat conduction

Journal Articles

Size and Interface Effects on Thermal Conductivity of Superlattices and Periodic Thin-Film Structures

G. Chen

Publisher: ASME

J. Heat Mass Transfer. May 1997, 119(2): 220–229.

https://doi.org/10.1115/1.2824212

Published Online: May 1, 1997

View Article titled, Size and Interface Effects on Thermal Conductivity of Superlattices and Periodic Thin-Film Structures

Topics: Superlattices, Thermal conductivity, Thin films, Interface roughness, Amorphous materials, Bulk solids, Electromagnetic scattering, Gallium arsenide, Heat, Heat conduction

Journal Articles

A Note on the Evaluation of Thermal Constriction Resistance for Finite Thickness Gaps

Ashok Kumar Das, Satwindar Singh Sadhal

Publisher: ASME

J. Heat Mass Transfer. February 1997, 119(1): 177–180.

https://doi.org/10.1115/1.2824084

Published Online: February 1, 1997

View Article titled, A Note on the Evaluation of Thermal Constriction Resistance for Finite Thickness Gaps

Topics: Electronic equipment, Heat conduction, Packaging

Journal Articles

Elastoplastic Constriction Resistance Model for Sphere-Flat Contacts

M. R. Sridhar, M. M. Yovanovich

Publisher: ASME

J. Heat Mass Transfer. February 1996, 118(1): 202–205.

https://doi.org/10.1115/1.2824037

Published Online: February 1, 1996

View Article titled, Elastoplastic Constriction Resistance Model for Sphere-Flat Contacts

Topics: Electronic equipment, Heat conduction, Packaging

Journal Articles

The Thermal Contact Conductance of Hard and Soft Coat Anodized Aluminum

M. A. Lambert, E. E. Marotta, L. S. Fletcher

Publisher: ASME

J. Heat Mass Transfer. May 1995, 117(2): 270–275.

https://doi.org/10.1115/1.2822516

Published Online: May 1, 1995

View Article titled, The Thermal Contact Conductance of Hard and Soft Coat Anodized Aluminum

Topics: Aluminum, Contact resistance, Coatings, Temperature, Electrical conductance, Electrolytes, Low temperature, Pressure, Anodizing, Electronic equipment

Journal Articles

Thermal Contact Conductance of Ceramic Substrate Junctions

K. C. Chung, H. K. Benson, J. W. Sheffield

Publisher: ASME

J. Heat Mass Transfer. May 1995, 117(2): 508–510.

https://doi.org/10.1115/1.2822552

Published Online: May 1, 1995

View Article titled, Thermal Contact Conductance of Ceramic Substrate Junctions

Topics: Ceramics, Contact resistance, Heat conduction, Junctions, Packaging

Journal Articles

The Interfacial Pressure Distribution and Thermal Conductance of Bolted Joints

M. Mittelbach, C. Vogd, L. S. Fletcher, G. P. Peterson

Publisher: ASME

J. Heat Mass Transfer. November 1994, 116(4): 823–828.

https://doi.org/10.1115/1.2911454

Published Online: November 1, 1994

View Article titled, The Interfacial Pressure Distribution and Thermal Conductance of Bolted Joints

Topics: Bolted joints, Pressure, Thermal conductivity, Stress, Temperature, Aluminum, Electronic equipment, Flux (Metallurgy), Gaskets, Heat

Journal Articles

Analysis of Heat Transfer Regulation and Modification Employing Intermittently Emplaced Porous Cavities

K. Vafai, P. C. Huang

Publisher: ASME

J. Heat Mass Transfer. August 1994, 116(3): 604–613.

https://doi.org/10.1115/1.2910912

Published Online: August 1, 1994

View Article titled, Analysis of Heat Transfer Regulation and Modification Employing Intermittently Emplaced Porous Cavities

Topics: Cavities, Heat transfer, Flow (Dynamics), Skin friction (Fluid dynamics), Temperature, Composite materials, Finite difference methods, Inertia (Mechanics), Manufacturing, Materials processing

Journal Articles

Optimal Sizing of Planar Thermal Spreaders

S. Hingorani, C. J. Fahrner, D. W. Mackowski, J. S. Gooding, R. C. Jaeger

Publisher: ASME

J. Heat Mass Transfer. May 1994, 116(2): 296–301.

https://doi.org/10.1115/1.2911399

Published Online: May 1, 1994

View Article titled, Optimal Sizing of Planar Thermal Spreaders

Topics: Dimensions, Heat conduction, Heat flux, Heat transfer, Packaging, Temperature

Journal Articles

Orientation Effects on Critical Heat Flux From Discrete, In-Line Heat Sources in a Flow Channel

C. O. Gersey, I. Mudawar

Publisher: ASME

J. Heat Mass Transfer. November 1993, 115(4): 973–985.

https://doi.org/10.1115/1.2911394

Published Online: November 1, 1993

View Article titled, Orientation Effects on Critical Heat Flux From Discrete, In-Line Heat Sources in a Flow Channel

Topics: Critical heat flux, Flow (Dynamics), Heat, Vapors, Boiling, Coolants, Floods, Flux (Metallurgy), Gravity (Force), Hydrodynamics

Journal Articles

Thermal Gap Conductance of Conforming Surfaces in Contact

S. Song, M. M. Yovanovich, F. O. Goodman

Publisher: ASME

J. Heat Mass Transfer. August 1993, 115(3): 533–540.

https://doi.org/10.1115/1.2910719

Published Online: August 1, 1993

View Article titled, Thermal Gap Conductance of Conforming Surfaces in Contact

Topics: Electrical conductance, Heat conduction, Surface roughness, Plates (structures), Electronic equipment, Gases, Heat transfer, Helium, Nickel, Nitrogen

Journal Articles

Effect of Surface Deformations on Contact Conductance

M. Williamson, A. Majumdar

Publisher: ASME

J. Heat Mass Transfer. November 1992, 114(4): 802–810.

https://doi.org/10.1115/1.2911886

Published Online: November 1, 1992

View Article titled, Effect of Surface Deformations on Contact Conductance

Topics: Deformation, Electrical conductance, Aluminum, Stainless steel, Stress, Surface roughness, Cycles, Copper, Heat conduction, Metals

Journal Articles

Heat Transfer in Power Cables Packaged Inside Trays

Z. Zhao, Z. Ren, D. Poulikakos

Publisher: ASME

J. Heat Mass Transfer. August 1992, 114(3): 777–780.

https://doi.org/10.1115/1.2911351

Published Online: August 1, 1992

View Article titled, Heat Transfer in Power Cables Packaged Inside Trays

Topics: Cables, Heat transfer, Natural convection, Packaging, Radiation (Physics)

Journal Articles

Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing

A. M. Anderson, R. J. Moffat

Publisher: ASME

J. Heat Mass Transfer. February 1991, 113(1): 56–62.

https://doi.org/10.1115/1.2910551

Published Online: February 1, 1991

View Article titled, Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing

Topics: Cooling, Electronic components, Forced convection, Temperature, Fluids, Heating, Pressure drop, Computer cooling, Coolants, Electronic equipment

Journal Articles

Applying Heat Transfer Coefficient Data to Electronics Cooling

R. J. Moffat, A. M. Anderson

Publisher: ASME

J. Heat Mass Transfer. November 1990, 112(4): 882–890.

https://doi.org/10.1115/1.2910495

Published Online: November 1, 1990

View Article titled, Applying Heat Transfer Coefficient Data to Electronics Cooling

Topics: Computer cooling, Heat transfer coefficients, Temperature, Databases, Heat, Cooling, Cooling systems, Design, Discrete systems, Electronic equipment

Journal citation

NARROW

Foreword

SHEAR LAYER INSTABILITY AND MIXING IN MICRO HEAT SPREADERS

Predictions of Turbulent Heat Transfer in an Axisymmetric Jet Impinging on a Heated Pedestal

A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages

Thermal Contact Conductance of Spherical Rough Metals

Thermal Conductivity Measurements in Printed Wiring Boards

Size and Interface Effects on Thermal Conductivity of Superlattices and Periodic Thin-Film Structures

A Note on the Evaluation of Thermal Constriction Resistance for Finite Thickness Gaps

Elastoplastic Constriction Resistance Model for Sphere-Flat Contacts

The Thermal Contact Conductance of Hard and Soft Coat Anodized Aluminum

Thermal Contact Conductance of Ceramic Substrate Junctions

The Interfacial Pressure Distribution and Thermal Conductance of Bolted Joints

Analysis of Heat Transfer Regulation and Modification Employing Intermittently Emplaced Porous Cavities

Optimal Sizing of Planar Thermal Spreaders

Orientation Effects on Critical Heat Flux From Discrete, In-Line Heat Sources in a Flow Channel

Thermal Gap Conductance of Conforming Surfaces in Contact

Effect of Surface Deformations on Contact Conductance

Heat Transfer in Power Cables Packaged Inside Trays

Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing

Applying Heat Transfer Coefficient Data to Electronics Cooling

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