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Journal Articles

A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages

S. Sathe, B. Sammakia
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1998, 120(4): 830–839.
https://doi.org/10.1115/1.2825902
Published Online: November 1, 1998
View Article titled, A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages
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Topics: Electronic packages, Energy dissipation, Heat sinks, Accounting, Adhesives, Cooling, Electronics, Heat, Heat transfer, Manufacturing
Journal Articles

The Thermal Resistance of Adhesive Bonds

D. M. Lewis, H. J. Sauer, Jr.
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. May 1965, 87(2): 310–311.
https://doi.org/10.1115/1.3689097
Published Online: May 1, 1965
View Article titled, The Thermal Resistance of Adhesive Bonds
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Topics: Adhesives, Thermal resistance