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Keywords: temperature control
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Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041005.
Published Online: October 21, 2009
...A. D. Laws; R. Borwick, III; P. Stupar; J. DeNatale; Y. C. Lee The power dissipation for chip-scale atomic clocks (CSAC) is one of the major design considerations. 12 mW of the 30 mW power budget is for temperature control of the vertical-cavity-surface-emitting laser (VCSEL) and the alkali-metal...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021011.
Published Online: May 15, 2008
... cell, contained in the clock, must be maintained at 70 ± 0.1 ° C even under an ambient temperature variation of − 40 ° C to 50 ° C . A thermal test vehicle has been developed to characterize a sample package with a thermal conduction switch. Three cases are presented for the temperature control...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 137–144.
Published Online: November 11, 2005
... temperature control can regulate the hottest inlet temperature to T ref , but cannot affect the relative distribution of the rack inlet temperatures locally. This means that all the other rack inlet temperatures, aside from the hottest one...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
Published Online: January 24, 2005
... April 2004 22 June 2004 24 01 2005 integrated circuit packaging semiconductor device packaging heat exchangers heat transfer temperature control rods (structures) flow simulation IC Cooling Heat Spreader Mathematical Thermal Model 1D Non-Uniform Rod Once a first...