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Keywords: solder joint
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011008.
Paper No: EP-23-1011
Published Online: July 21, 2023
...Mohamed El Amine Belhadi; Sa'd Hamasha; Ali Alahmer; Xin Wei; Abdallah Alakayleh In realistic applications, the solder joint is continually subjected to thermal-mechanical stress due to the difference in the coefficient of thermal expansion between the printed circuit board substrate...
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Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011008.
Paper No: EP-19-1117
Published Online: June 23, 2020
...Minghong Jian; Sinan Su; Sa'd Hamasha; Mohammad M. Hamasha; Atif Alkhazali The reliability of solder joints plays a critical role in electronic assemblies. SnAgCu solder alloys with doped elements such as Bi and Sb is one of the candidates for high reliability applications. However, the mechanical...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
Published Online: May 17, 2019
...Sinan Su; Francy John Akkara; Ravinder Thaper; Atif Alkhazali; Mohammad Hamasha; Sa'd Hamasha Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
Published Online: September 14, 2011
...Tong An; Fei Qin The significant difference between failure modes of lead-containing and lead-free solder joints under drop impact loading remains to be not well understood. In this paper, we propose a feasible finite element approach to model the cracking behavior of solder joints under drop...
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Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 98–104.
Published Online: April 18, 2006
...Chang-Lin Yeh; Yi-Shao Lai The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. Following classical structural dynamics principles...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
Published Online: July 14, 1999
...S. H. Fan; Y. C. Chan; J. K. L. Lai The shear cycle fatigue lifetimes of plastic ball grid array (PBGA) solder joints formed using different reflow profiles are studied in this paper. The profiles were devised to have the same “heating factor” but to have different conveyor speeds. The test results...