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Keywords: process modeling
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011004.
Paper No: EP-19-1023
Published Online: September 19, 2019
... of the molded wafer are identified through parametric analysis. e-mail:  hccheng@fcu.edu.tw 16 02 2019 13 08 2019 19 09 2019 fan-out wafer-level package warpage process modeling cure state volumetric shrinkage Fan-out wafer-level packaging (FOWLP), extending from wafer...