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Keywords: plastic zone size
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
Published Online: March 31, 2022
..., significantly larger plastic zone size and thinner intermetallic compound layer resulted in significantly higher G ci for Sn-0.7Cu solder joint. The IMC layer thickness was observed to be thinner for Sn-0.7Cu than Ag containing SAC305 and SACX0307 solder joints. The IMC layer was found to have elongated like...