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Keywords: multichip modules
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011006.
Published Online: February 12, 2009
...Dapeng Zhu; Xiaoqin Lin; Le Luo The aim of this work is to evaluate the changes in microstructures and electrical properties of a tantalum nitride (Ta–N) thin film integrated on an aluminum anodization multichip module deposited (MCM-D) substrate. A Ta–N resistor with a thickness of 100 nm...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
Published Online: April 16, 2007
... into consideration, effects that were studied in detail by other teams. integrated circuit packaging multichip modules thermal analysis 05 01 2006 16 04 2007 Sabry , M. N. , 2003 , “ Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
Published Online: January 25, 2007
...Y. C. Lee; C. J. Fang; M. C. Wu; C. H. Peng; Y. H. Hung An effective method for performing the thermal optimization of stationary and rotating multichip module (MCM) disks with an unconfined round-jet impingement under space limitation constraint has been successfully developed. The design...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 400–410.
Published Online: December 28, 2006
...C. J. Fang; M. C. Wu; Y. M. Kuo; C. Y. Lee; C. H. Peng; Y. H. Hung A series of experimental investigations on the studies related to fluid flow and transient mixed convection from a horizontally unconfined stationary or rotating ceramic-based multichip module (MCM) disk with unconfined jet...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
Published Online: August 24, 2006
... circuits multichip modules system-in-package CMOS capacitor stress In this study, the effects of mechanical stress on on-wafer capacitors are studied. The magnitude of the capacitance changes is analyzed on the grounds of the varying placement, geometry, and size of the capacitors...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
Published Online: January 24, 2005
... not achieve the high heat transfer coefficients at a low pressure drop. Manuscript received June 11, 2004; revision received August 10, 2004. Review conducted by: D. Agonafer. 11 June 2004 10 August 2004 24 01 2005 heat sinks multichip modules heat transfer thermal analysis...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
Published Online: October 6, 2004
... multichip modules natural convection finite element analysis infrared imaging heat conduction heat transfer Three-Dimensional (3-D) packaging of multiple chips modules, the so-called vertical (or stacked) MCM packaging technologies, provides a very engaging packaging option, as compared...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 159–172.
Published Online: April 30, 2004
... January 2003 01 November 2003 30 04 2004 multichip modules ceramic packaging heat transfer nozzles convection Recently, the demand for compactness and higher operational speeds has led to high power density in electronic packages. It is well-known that the failure...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
Published Online: July 26, 2002
... in these applications. thermal management (packaging) integrated optoelectronics optical computing finite element analysis thermal analysis multichip modules heat sinks cooling 2002 ASME ...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 1–6.
Published Online: January 12, 2001
... publication (Chahal et al. 2 ). filled polymers nanostructured materials capacitors multichip modules materials preparation electron device manufacture 2002 ASME ...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 247–254.
Published Online: September 1, 2000
... of Maryland, College Park, MD 20742. Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: Y. C. Lee multichip modules electric connectors printed circuit accessories electronic design automation...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 233–239.
Published Online: September 1, 2000
... provides a means for obtaining a unique analytical solution for complex IC packages. Comparisons are made with published experimental data for both a plastic quad flat package and a multichip module to demonstrate that an analytical approach can offer an accurate and efficient solution procedure...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 86–91.
Published Online: December 29, 1999
... packaging. [S1043-7398(00)00702-7] stainless steel substrates multichip modules moire fringes Stainless steel offers numerous advantages over traditional electronic materials due to its superior strength-to-weight ratio, flexibility, corrosion resistance, impact strength, thickness, thermal...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 77–85.
Published Online: November 22, 1999
... PACKAGING . Manuscript received by the EEPD April 9, 1999; revision received November 22, 1999. Associate Technical Editor: M. Shiratori. 09 April 1999 22 November 1999 multichip modules dielectric thin films stainless steel substrates Stainless steel offers numerous...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 115–120.
Published Online: November 9, 1999
...Yu-Jung Huang; Shen-Li Fu This paper introduces an algorithm that focuses on the placement of the power dissipating chips for multichip module applications. The main design issue is addressed on the chip placement to achieve uniform thermal distribution. Our approach to the placement problem...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 55–60.
Published Online: August 31, 1999
... Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD June 1, 1999; revision received August 31, 1999. Associate Technical Editor: B. Michel. 01 June 1999 31 August 1999 multichip modules adhesives polymers thermal management (packaging...