1-16 of 16
Keywords: multichip modules
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011006.
Published Online: February 12, 2009
...Dapeng Zhu; Xiaoqin Lin; Le Luo The aim of this work is to evaluate the changes in microstructures and electrical properties of a tantalum nitride (Ta–N) thin film integrated on an aluminum anodization multichip module deposited (MCM-D) substrate. A Ta–N resistor with a thickness of 100 nm...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
Published Online: April 16, 2007
... temperatures to heat fluxes having a size of the order of ten. The former, resistance network, can always be rewritten in the form of a matrix. integrated circuit packaging multichip modules thermal analysis 05 01 2006 16 04 2007 Using the above Green’s function, as well...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 400–410.
Published Online: December 28, 2006
...C. J. Fang; M. C. Wu; Y. M. Kuo; C. Y. Lee; C. H. Peng; Y. H. Hung A series of experimental investigations on the studies related to fluid flow and transient mixed convection from a horizontally unconfined stationary or rotating ceramic-based multichip module (MCM) disk with unconfined jet...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
Published Online: August 24, 2006
... circuits multichip modules system-in-package CMOS capacitor stress An illustration showing the basic idea of the 4PB loading fixture used is presented in Fig. 1 . Basic sketch of the 4PB fixture F i and F p represent the outer weight-dependent force...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
Published Online: January 24, 2005
... fins k =thermal conductivity Re =Reynolds number based on the hydraulic diameter The current study deals with a numerical and experimental investigation of a very high aspect ratio heat sink, used for impingement air cooling of a multichip module. The heat sink was designed...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 159–172.
Published Online: April 30, 2004
.... Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received January 2003; final revision, November 2003. Associate Editor: K. Kishimoto. 01 January 2003 01 November 2003 30 04 2004 multichip modules...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 1–6.
Published Online: January 12, 2001
... manuscript received January 12, 2001. Associate Editor: G. De Mey. 29 June 1999 12 January 2001 filled polymers nanostructured materials capacitors multichip modules materials preparation electron device manufacture Passive components such as resistors, capacitors...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 247–254.
Published Online: September 1, 2000
...,” Institute for Systems Research, University of Maryland, College Park, MD 20742. Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: Y. C. Lee multichip modules electric connectors printed...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 86–91.
Published Online: December 29, 1999
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD June 1, 1999; revision received December 29, 1999. Associate Technical Editor: B. Michel. 01 June 1999 29 December 1999 stainless steel substrates multichip modules moire fringes Stainless steel offers...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 77–85.
Published Online: November 22, 1999
... OF ELECTRONIC PACKAGING . Manuscript received by the EEPD April 9, 1999; revision received November 22, 1999. Associate Technical Editor: M. Shiratori. 09 April 1999 22 November 1999 multichip modules dielectric thin films stainless steel substrates One of the key issues for the use...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 115–120.
Published Online: November 9, 1999
...Yu-Jung Huang; Shen-Li Fu This paper introduces an algorithm that focuses on the placement of the power dissipating chips for multichip module applications. The main design issue is addressed on the chip placement to achieve uniform thermal distribution. Our approach to the placement problem...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 55–60.
Published Online: August 31, 1999
.... Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD June 1, 1999; revision received August 31, 1999. Associate Technical Editor: B. Michel. 01 June 1999 31 August 1999 multichip modules...