...Dapeng Zhu; Xiaoqin Lin; Le Luo The aim of this work is to evaluate the changes in microstructures and electrical properties of a tantalum nitride (Ta–N) thin film integrated on an aluminum anodization multichip module deposited (MCM-D) substrate. A Ta–N resistor with a thickness of 100 nm...

... to deal with geometries that can be decomposed into boxes. 05 01 2006 16 04 2007 integrated circuit packaging multichip modules thermal analysis Using the above Green’s function, as well as the Green’s theorem, Eq. 3a can be transformed into 3.2 T ( r ) − T av...

...Y. C. Lee; C. J. Fang; M. C. Wu; C. H. Peng; Y. H. Hung An effective method for performing the thermal optimization of stationary and rotating multichip module (MCM) disks with an unconfined round-jet impingement under space limitation constraint has been successfully developed. The design...

...C. J. Fang; M. C. Wu; Y. M. Kuo; C. Y. Lee; C. H. Peng; Y. H. Hung A series of experimental investigations on the studies related to fluid flow and transient mixed convection from a horizontally unconfined stationary or rotating ceramic-based multichip module (MCM) disk with unconfined jet...

... of metals is much lower than that of semiconductors and stress-induced resistivity change was not found in the MIM capacitors. 24 04 2006 24 08 2006 capacitors CMOS integrated circuits multichip modules system-in-package CMOS capacitor stress Current electronics...

... fins k =thermal conductivity Re =Reynolds number based on the hydraulic diameter The current study deals with a numerical and experimental investigation of a very high aspect ratio heat sink, used for impingement air cooling of a multichip module. The heat sink was designed...

... multichip modules natural convection finite element analysis infrared imaging heat conduction heat transfer The validity of the proposed FE modeling (i.e., DFEA) is assessed through the TTD measurement and the modified IRTTC approach. It involves the validation of both the heat conduction FE...

... January 2003 01 November 2003 30 04 2004 multichip modules ceramic packaging heat transfer nozzles convection Recently, the demand for compactness and higher operational speeds has led to high power density in electronic packages. It is well-known that the failure...

... . Manuscript received by the EPPD September 5, 2000. Associate Editor: B. Michel. 05 September 2000 26 07 2002 thermal management (packaging) integrated optoelectronics optical computing finite element analysis thermal analysis multichip modules heat sinks cooling...

... manuscript received January 12, 2001. Associate Editor: G. De Mey. 29 June 1999 12 January 2001 filled polymers nanostructured materials capacitors multichip modules materials preparation electron device manufacture Passive components such as resistors, capacitors...

.... Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: Y. C. Lee multichip modules electric connectors printed circuit accessories electronic design automation finite element analysis quadratic...

... provides a means for obtaining a unique analytical solution for complex IC packages. Comparisons are made with published experimental data for both a plastic quad flat package and a multichip module to demonstrate that an analytical approach can offer an accurate and efficient solution procedure...

... 29 December 1999 stainless steel substrates multichip modules moire fringes Stainless steel offers numerous advantages over traditional electronic materials due to its superior strength-to-weight ratio, flexibility, corrosion resistance, impact strength, thickness, thermal...

... OF ELECTRONIC PACKAGING . Manuscript received by the EEPD April 9, 1999; revision received November 22, 1999. Associate Technical Editor: M. Shiratori. 09 April 1999 22 November 1999 multichip modules dielectric thin films stainless steel substrates Stainless steel offers...

...Yu-Jung Huang; Shen-Li Fu This paper introduces an algorithm that focuses on the placement of the power dissipating chips for multichip module applications. The main design issue is addressed on the chip placement to achieve uniform thermal distribution. Our approach to the placement problem...

... functionality and adhesive reworkability is presented in this study. In addition, finite element modeling is used to predict the out-of-plane warpage, axial, and interfacial stresses of the tiles-on-pallet palletized assemblies. [S1043-7398(00)00501-6] multichip modules adhesives polymers thermal...