1-7 of 7
Keywords: microstructure
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031005.
Paper No: EP-22-1066
Published Online: January 27, 2023
... exhibit early failure [ 6 ]. The existing literature on the fatigue characteristics of solder alloys with either rectangular or circular cross section employed bulk specimen testing [ 7 – 10 ]. However, because real solder joints have various microstructures, differences in their mechanical and fatigue...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021007.
Paper No: EP-22-1044
Published Online: September 28, 2022
... to be insensitive. Several failure modes were detected for Sn-3.5Ag in both shear strength and fatigue tests. 1 Corresponding author. e-mail:  smh0083@auburn.edu e-mail:  arnazmus.sakib@nxp.com 28 05 2022 16 08 2022 28 09 2022 microstructure Sn alloys shear fatigue solder...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011002.
Paper No: EP-20-1077
Published Online: August 6, 2021
...Zheng Liu; Li Yang; Yifeng Xiong; Huiming Gao The effect of trace Nb nanoparticles on the thermal properties, wettability, microstructure, and mechanical properties of Sn–0.7Cu solder alloy was investigated. The results showed that the melting temperature of Sn–0.7Cu composite solder alloy...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021002.
Paper No: EP-17-1123
Published Online: March 1, 2019
.... 27 11 2017 07 02 2019 lead-free solder hysteresis thermal cycling damage microstructure Electronic equipment for aerospace and military applications can encounter a wide range of environmental stresses mainly due to thermomechanical loadings (temperature variations...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
Published Online: June 23, 2011
...Chu-Hsuan Sha; Chin C. Lee A fundamental study is carried out to investigate the microstructure and surface treatment possibilities of 304 stainless steel (304SS) substrates. To expose the microstructure, mirror-finished 304SS is applied with a self-mixed etchant containing ammonium sulfite ((NH 4...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
Published Online: June 22, 2011
... integrated circuit bonding scanning electron microscopy silicon thermal expansion solid state bonding gold electroplating microstructure silicon chip alumina substrate Even though plastic packages are popular these days, ceramic packages still play as a significant role in high...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011006.
Published Online: February 12, 2009
...Dapeng Zhu; Xiaoqin Lin; Le Luo The aim of this work is to evaluate the changes in microstructures and electrical properties of a tantalum nitride (Ta–N) thin film integrated on an aluminum anodization multichip module deposited (MCM-D) substrate. A Ta–N resistor with a thickness of 100 nm...