... circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits optoelectronics embedded 3D hybrid integration system in package thermal design The major trend...

... 10 2006 electronics packaging integrated optoelectronics polymers stochastic processes surface emitting lasers viscoelasticity uncertainty stochastic characterization photonic system epoxy viscoelastic behavior dynamic mechanical analysis Monte Carlo simulation...

... to be in reasonable agreement. However, the vertical fiber displacement tends to be overpredicted by the steady-state solution, sometimes by as much as an order of magnitude. The causes, both physical and computational, of this disagreement are discussed. 28 01 2004 01 11 2004 integrated...

... . Manuscript received by the EPPD September 5, 2000. Associate Editor: B. Michel. 05 September 2000 26 07 2002 thermal management (packaging) integrated optoelectronics optical computing finite element analysis thermal analysis multichip modules heat sinks cooling...