... accelerated thermal cycling. 20 09 2006 13 02 2007 ball grid arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Microelectronic packaging industry...

... 12 2002 flip-chip devices integrated circuit interconnections encapsulation integrated circuit packaging plastic packaging shear strength heat treatment interface structure reflow soldering surface chemistry As the trend in requirements of electronic packaging is toward...

... 20, 2002. Associate Editor: A. Tay. 01 April 2001 20 April 2002 12 12 2002 encapsulation flip-chip devices chip-on-board packaging integrated circuit packaging plastic packaging polymer films heat treatment differential scanning calorimetry The reliability...

...-on-board packaging plastic packaging curvature measurement measurement by laser beam finite element analysis thermal expansion bending heat treatment Controlling surface warpage of electronic packages becomes more and more critical (Chua et al. 1 , Kuan and Cheng 2 , and Miyake and Saitou...