.... 23 12 2011 24 04 2013 Heat conduction analysis is performed on a model system to survey the effects of geometric and thermal parameters on the temperature of an embedded heat source. A box model has the geometric characteristics of hand-held devices and has a laminar organization...

... of substrate heat conduction on heat transfer from the embedded heat source to the coolant flow in the channel. From Fig. 4 of Ref. [ 33 ], we find the substrate conduction lowers the direct heat transfer from the heat source surface by about 10%, an insignificant number in this rule-of thumb estimate. From...

... can be learned from the calculations. multicore processor hot spot heat conduction Fourier-series solution checkered pattern cell arrangement Possible occurrence of hot spots on the integrated circuit chip has become a major source of concern for circuit designers. For current...

... the VC. The sintered copper powder is isotropic. The vapor condenses and the liquid evaporates only at the interface between the vapor and liquid-wick regions. Thus, only heat conduction exists in the wick. Pores of the sintered copper powder are saturated with liquid. There is no gap...

...Cheng-Hung Huang; Wei-Lun Chang A three-dimensional inverse heat conduction problem is solved in the present study by using the conjugate gradient method (CGM) and the general-purpose commercial code CFD − ACE + to estimate the strength of the unknown heat generation for an encapsulated chip...

.... J. Heat Mass Transfer 0017-9310 , 43 ( 12 ), pp. 2101 – 2115 . 10.1016/S0017-9310(99)00283-5 2007 , COMSOL MULTIPHYSICS , version 3.3, Users’ Manuals. 29 07 2008 30 01 2009 31 07 2009 heat conduction heat exchangers numerical analysis heat exchangers...

... and temperature distributions, maximum temperature heat sources, percentage contribution of plate (substrate) heat conduction on the heat removal from electronic components, temperature profile within finite conductive plate and local heat flux density at the plate—modules/PCM interface. The effect of these two...

... computational fluid dynamics finite volume methods forced convection heat conduction heat sinks metal foams stratified flow thermal conductivity 21 11 2007 07 01 2009 27 03 2009 2009 American Society of Mechanical Engineers ...

... (rise from the ambient) decreases only by 2%. 2 As in “thermal vias” the effectiveness of through-vias is often expected to enhance heat conduction to the bottom of the PCB. However, the presence of large thermal resistance on the bottom surface compromises the thermal-via effect. Instead...

...Wataru Nakayama This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a thickness distribution so as to provide spatially varying heat conduction paths from the heat...

... for full chip Joule heating simulations and for clock signal propagation simulations, which are performed as part of designing next generation chip architectures. 13 03 2006 23 10 2007 29 07 2008 heat conduction integrated circuit interconnections mesh generation...

... through experimentation and finite element analysis. 20 02 2007 03 10 2007 15 05 2008 atomic clocks bimetals chip scale packaging discs (structures) heat conduction switches temperature control thermal management (packaging) The goal of the DARPA chip scale atomic...

...% tolerance 10 × voltage divider. All sensor data was digitally recorded using an Agilent E8408A VXI mainframe with an E1413C 64 channel 16 bit A/D converter. coatings cooling electronics packaging evaporation heat conduction microprocessor chips pool boiling microporous...

...James Geer; Anand Desai; Bahgat Sammakia This paper presents the results of an analytical study of steady state heat conduction in multiple rectangular domains. Any finite number of domains that are equally sized (in plane) may be considered in the current analysis. The thermal conductivity...

... dimensional constraints. This paper shows a numerical approach, based on computational fluid dynamics (CFD) software, for the evaluation of the heat exchange performances of finned (straight fins) surfaces made of highly heat conductive material. The same geometric constraints assumed in a reference work were...

... building blocks of spintronic devices. Experiments showed that the thermal resistance of nanoscale AlO x tunnel barriers increases linearly with thickness, which is consistent with the theory of energy transport in highly disordered materials. Heat conduction across a tunnel junction is impeded...

... sintering heat conduction integrated circuit packaging thermal management (packaging) channel flow The integrated circuit (IC) industry is manufacturing denser and more powerful products, thus necessitating a better cooling technology to prevent the demand from heat dissipation devices...

...Anand Desai; James Geer; Bahgat Sammakia An analytical model of steady state heat conduction in multiple cylindrical domains is presented and discussed. The domains are axisymmetric, contiguous, and coaxial. Three domains are considered in the current study. The thermal conductivities, thicknesses...

...Brian H. Dennis; Zhen-xue Han; George S. Dulikravich A finite element method (FEM) formulation for the prediction of unknown steady boundary conditions in heat conduction for multidomain three-dimensional (3D) solid objects is presented. The FEM formulation is capable of determining temperatures...

... the reliability of electronic packaging structures. Therefore, it is important to provide designers a good estimate of free edge stresses. According to the heat conduction mechanism of integrated circuits, the temperature field distribution in the chip and substrate is derived and solved when the chip works...