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Keywords: flip-chip devices
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
Published Online: December 9, 2011
... ) the half-GPD model ( μ m) The Von Mises stress contour plot of ( a ) the octant model; and ( b ) the half-GPD model (MPa) 28 05 2010 24 08 2011 09 12 2011 09 12 2011 finite element analysis flip-chip devices optimisation In chip-to-substrate connections...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
Published Online: September 30, 2011
... 30 09 2011 30 09 2011 bonding processes chromium copper electric properties flip-chip devices gold packaging silver soldering thermal expansion silver joints flip-chip interconnect solid-state bonding electronic packaging Si chips Cu substrates At present...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041012.
Published Online: December 8, 2010
..., underfill material properties are crucial to package reliability performance ( 1 2 ). amine-based phenolic-based reliability underfill adhesion ball grid arrays flip-chip devices fracture toughness testing plastic packaging reliability thermal expansion Young's modulus 06 08...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041013.
Published Online: December 8, 2010
... 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder wetting dynamics While next generation flip chip processing holds many...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041006.
Published Online: November 24, 2010
..., and the rising and delay time affects the bonding quality due to the temperature of the tool head. 03 03 2009 19 09 2010 24 11 2010 24 11 2010 bonding processes electronics packaging flip-chip devices light emitting diodes principal component analysis Taguchi methods Among...
Journal Articles
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. September 2010, 132(3): 035001.
Published Online: September 30, 2010
... 30 09 2010 flip-chip devices integrated circuit bonding In this research, we explored the possibility of using pure silver (Ag) to make flip-chip joints between Si chips and copper (Cu) substrates. Cu was chosen in this study because Cu electrodes or Cu substrates had been extensively...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031008.
Published Online: September 9, 2010
... 06 06 2010 09 09 2010 09 09 2010 adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys The move to lead free soldering raises questions as to the systematic knowledge and insights...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
Published Online: March 19, 2010
... of interface delamination between epoxy molding compound and silicon die in the flip chip ball grid array package. 14 02 2009 10 01 2010 19 03 2010 19 03 2010 ball grid arrays delamination finite element analysis flip-chip devices integrated circuit reliability shrinkage...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041002.
Published Online: October 21, 2009
...://www.electrooptics.com/ Moaveni , S. , 1999 , Finite Element Analysis: Theory and Application With ANSYS , Prentice Hall , Englewood Cliffs, NJ . 28 09 2008 11 07 2009 21 10 2009 data communication electronics packaging flip-chip devices light emitting diodes optical fibre...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
Published Online: July 31, 2009
...-chip devices lead mass spectroscopic chemical analysis solders tin flip chip fine pitch high I/O density no-flow underfill void formation gas chromatography-mass spectrum chemical reaction Increasing demand for high performance devices initiated the development of flip chip...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031005.
Published Online: June 23, 2009
... 06 2009 assembling bonding processes flip-chip devices interconnections reliability thermal analysis flip chip package capillary-flow underfill no-flow underfill assembly process warpage reliability The semiconductor package trend has an increased need for flip chip (F...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
Published Online: February 18, 2009
... accuracy at a relatively low cost. laser ultrasound flip chip solder bump local temporal coherence lead-free laser vibrometer chip scale packaging electronics packaging flip-chip devices laser beam applications light interferometry solders thermoelasticity ultrasonic applications...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044501.
Published Online: November 17, 2008
..., the measured insertion loss is less than 3 dB for frequencies of up to 35 GHz and the return loss is higher than 15 dB for frequencies of up to 29 GHz using CPS flip-chip configuration. 11 12 2007 09 04 2008 17 11 2008 coplanar waveguides flip-chip devices integrated circuit...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041001.
Published Online: November 13, 2008
... electromigration is responsible for metallization failures that lead to an excessive increase in the resistance of the solder joints. electromigration flip-chip solder joint reliability Sn–Ag–Cu Cu weight content copper alloys electromigration flip-chip devices gold nickel reliability...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031008.
Published Online: August 1, 2008
... ; ( b ) linewidth of 100 μ m . 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031009.
Published Online: August 1, 2008
... sensitive to defects have been extracted and analyzed by the authors ( 4 ) and the results have shown the values of numerical modal analysis for experimental data analysis. 14 08 2007 07 01 2008 01 08 2008 flip-chip devices inspection modal analysis soldering solders surface...