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Keywords: finite volume methods
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
Published Online: November 24, 2010
... 24 11 2010 aluminium boundary layers computational fluid dynamics contact resistance convection finite volume methods heat sinks metal foams With the development of new high power-density electronics arises the need for more effective means of dissipating the excess heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
Published Online: April 1, 2009
... 07 01 2009 01 04 2009 finite volume methods heat sinks heat transfer laminar flow microchannel flow Navier-Stokes equations polynomial approximation quadratic programming response surface methodology thermal resistance trapezoidal microchannel electronic cooling...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
... is exceedingly high, the coolant may bypass the heat sink completely, if it is not contained within a sealed channel. aluminium computational fluid dynamics finite volume methods forced convection heat conduction heat sinks metal foams stratified flow thermal conductivity 21 11 2007...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021004.
Published Online: April 25, 2008
.... This model can handle local thermal nonequilibrium condition between the PCM and the solid matrix. The numerical model is based on volume averaging technique, and the finite volume method is used to discretize the heat diffusion equation. The findings show that, for steady heat generation, the shape...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 519–523.
Published Online: January 24, 2005
... by: B. Sammakia. 21 May 2004 19 July 2004 24 01 2005 heat sinks electronics packaging plates (structures) cooling convection jets nozzles flow simulation finite volume methods telecommunication The main objective of this study is to subject a flat parallel...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 465–471.
Published Online: January 24, 2005
... electronics packaging cooling product design convection turbulence flow simulation finite volume methods Cooling of electronic components is one of the main barriers to developing faster, smaller, and more reliable systems. Heat removal is critical to achieving higher data processing speeds...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 8–13.
Published Online: April 30, 2004
... by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2002. Associate Editor: A. Y-H. Hung. 01 February 2002 30 04 2004 thermal energy storage finite volume methods product design correlation methods...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 200–210.
Published Online: September 3, 1999
... . Editorial , 1994 , “ Journal of Heat Transfer Editorial Policy Statement on Numerical Accuracy ,” ASME J. Heat Transfer , 116 , pp. 797 – 798 . packaging finite volume methods heat transfer convergence of numerical methods temperature distribution thermodynamics Cabinets Numerical...