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Keywords: encapsulation
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041006.
Published Online: December 9, 2011
...Chih-Sung Chen Polymeric material has been applied in electronic product extensively, especially for packaging applications, thus thermomechanical analyses for encapsulated structure are frequently encountered. However, modulus and thermally induced strain of polymeric material are not constant...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011004.
Published Online: March 4, 2010
...Cheng-Hung Huang; Wei-Lun Chang A three-dimensional inverse heat conduction problem is solved in the present study by using the conjugate gradient method (CGM) and the general-purpose commercial code CFD − ACE + to estimate the strength of the unknown heat generation for an encapsulated chip...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011011.
Published Online: February 12, 2008
...Jason M. Brand; Salvatore A. Ruggero; Amip J. Shah As packaging continues to offer challenges with variable stacked die configurations of increasing complexity, traditional transfer mold encapsulation faces challenges in defining a robust process window. A major concern is the problem of “wiresweep...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 469–472.
Published Online: April 4, 2007
...Hong He; Renli Fu; Yanchun Han; Yuan Shen; Deliu Wang Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that is not cost effective enough. In this study, Si 3...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 307–315.
Published Online: December 11, 2006
...Shiang-Yu Teng; Sheng-Jye Hwang Warpage during integrated circuit encapsulation process is a serious problem. Previous researchers had focused on warpage analysis with thermal-induced shrinkage and the cure-induced shrinkage was neglected. A new approach considering both cure- and thermal-induced...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 144–148.
Published Online: June 13, 2006
...T. Bar-Kohany; A. Stern Generally, microelectro mechanical systems (MOEMS) devices require encapsulation for protecting their fragile and tiny inner components in a hermetically sealed cavity. Cavity hermeticity can be critical to the device performance and plays a vital role with respect...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 177–183.
Published Online: August 7, 2005
... on an encapsulated ICA flip chip interconnection. Experimental work included product lifetime measurement, cross section observation, and whole module warpage scanning. Results revealed that the chip-size effect on the ICA lifetime was obvious. A theoretical analysis was conducted with Finite Element Method (FEM...
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 47–51.
Published Online: March 21, 2005
...Man-Lung Sham; Jang-Kyo Kim Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 29–32.
Published Online: March 21, 2005
... for the application. This was because the encapsulation helped to protect the packages from moisture, etc. Analysis of the DOE runs was performed to determine parameter settings and select the adhesive material. Pareto analysis 10 was carried out. The estimated attribute frequencies of failure...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 370–374.
Published Online: March 9, 2005
...X. B. Chen In electronics packaging, one of the key processes is dispensing fluid materials, such as adhesive, epoxy, encapsulant, onto substrates or printed circuit boards for the purpose of surface mounting or encapsulation. In order to precisely control the dispensing process, the understanding...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
Published Online: December 2, 2004
... shift. Paddle shift is the deflection of the leadframe pad and die. Excessive paddle shift reduces the encapsulation protection for the components and may result in failures due to excessive wire sweep. Computer-aided analysis is one of the tools that could be used to simulate and predict the occurrence...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 335–339.
Published Online: November 3, 2004
... Circuits ,” ASME Winter Annual Meeting , ASME , New York, pp. 27 . Han , S. , 1994 , “ A Study on Plastic Encapsulation of Semiconductor Chips ,” Cornell Injection Molding Program Technical Report #77. Han , S. and Wang , K. K. , 1995 , “ Wire Sweep Analysis Related...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 262–267.
Published Online: June 26, 2004
... temperature around which the material properties, such as the CTE and Young’s modulus, are very sensitive to temperature. Polymer materials have wide applications in microelectronic packaging. Some polymer materials are used in bulk form, such as encapsulant (molding compound) and carrier or printed...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
Published Online: June 8, 2004
...Ji Hyuck Yang; Kang Yong Lee The purposes of the paper are to consider the failure phenomenon by delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process shows elastic and viscoelastic behaviors and to suggest the optimum design...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 617–620.
Published Online: December 15, 2003
..., and intermetallic thickness of both bonding systems was compared. Unencapsulated samples were subjected to a ball shear test while encapsulated samples were electrically tested. Results showed that the Cu-Al intermetallics layer is relatively harder than Au-Al. Both intermetallic thicknesses grow linearly at about...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 539–548.
Published Online: December 15, 2003
...L. J. Ernst; G. Q. Zhang; K. M. B. Jansen; H. J. L. Bressers For reliable virtual thermo-mechanical prototyping of electronic packages appropriate descriptions of the mechanical behavior of the constituent materials are essential. In many packages molding compounds are used for encapsulation...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 400–413.
Published Online: September 17, 2003
... 17 09 2003 internal stresses fracture encapsulation flip-chip devices packaging delamination The flip chip assembly used in electronic packaging applications consists of three main components (layers): a chip, an underfill (also called encapsulant), and a substrate. The assembly...