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Keywords: electroless nickel immersion gold (ENIG)
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... and Al metal to deposit Zn crystallites at the expense of Al dissolution (etching) ( 1 2 ). Zn then protects Al from reoxidizing until it ready to be plated. Electroless nickel immersion gold (ENIG) for under bump metallurgy (UBM) is gaining interest in flip chip packaging application because of its...
