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Keywords: electroless deposition
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... , E. , and Reichl , H. , 1990 , “ Electroless Deposition of Bumps for TAB Technology ,” Proceedings of 40th Electronic Components and Technology Conference , pp. 412 – 417 . Lin , K.-L. , and Chang , S.-Y. , 1996 , “ The Morphologies and the Chemical States of the Multiple...
