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Keywords: direct bonded copper (DBC)
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
Published Online: September 20, 2023
...Yujui Lin; Tiwei Wei; Wyatt Jason Moy; Hao Chen; Man Prakash Gupta; Michael Degner; Mehdi Asheghi; H. Alan Mantooth; Kenneth E. Goodson A microchannel heat sink integrated with a three-dimensional manifold using direct bonded copper (DBC) is promising for high power density electronics due...
Journal Articles