1-2 of 2
Keywords: direct bonded copper (DBC)
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
Published Online: September 20, 2023
...Yujui Lin; Tiwei Wei; Wyatt Jason Moy; Hao Chen; Man Prakash Gupta; Michael Degner; Mehdi Asheghi; H. Alan Mantooth; Kenneth E. Goodson A microchannel heat sink integrated with a three-dimensional manifold using direct bonded copper (DBC) is promising for high power density electronics due...
Journal Articles