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Journal Articles

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Yong Du, Jie-Hua Zhao, Paul Ho
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 196–199.
DOI: https://doi.org/10.1115/1.1347987
Published Online: March 21, 2000
...-on-board packaging plastic packaging curvature measurement measurement by laser beam finite element analysis thermal expansion bending heat treatment Controlling surface warpage of electronic packages becomes more and more critical (Chua et al. 1 , Kuan and Cheng 2 , and Miyake and Saitou...
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Topics: Electronic packages, Finite element analysis, Laser beams, Temperature, Flip-chip packages, Warping, Thermal expansion, Deformation, Lasers, Packaging