1-20 of 35
Keywords: creep
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031008.
Paper No: EP-23-1044
Published Online: March 13, 2024
... solders are sparse, especially regarding performance at cold temperatures. We report Garofalo creep data for 83Pb/10Sb/5Sn/2Ag (Indalloy 236) and 91.5Sn/8.5Sb (Indalloy 264). Indalloy 236 exhibits an activation energy of 54.5 kJ/mol, n = 4.5, and α = 0.043 while Indalloy 264 exhibits an activation energy...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
Published Online: May 17, 2019
... affecting the fatigue life of solder joints, which are: plastic strain-based fatigue models, creep damage-based fatigue models, energy-based fatigue models, and damage accumulation-based fatigue models. The models that do not fit any of the above categories are grouped into “other models.” Applications...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044501.
Published Online: November 17, 2011
...Yongchang Lee; Cemal Basaran Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
Published Online: December 3, 2010
... in the tensile region is different from that in the compressive region is employed for the fatigue test. Different fatigue lives due to different strain rates in the tensile and compression regions originate from the difference of development behaviors of creep strain generated in the cyclic loading. This paper...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
Published Online: November 23, 2010
...Ken-ichi Ohguchi; Katsuhiko Sasaki We previously proposed an elastic-plastic-creep model to estimate the fatigue strength of lead-free solder joints subjected to cyclic thermal loading. The proposed model requires detailed experimental data regarding the time-independent plastic strain and the time...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
...Ken-ichi Ohguchi; Katsuhiko Sasaki; Setsuo Aso This paper proposes a method to estimate basic material constants in an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading, which repeats instantaneous strain...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031004.
Published Online: July 29, 2008
...Min Pei; Jianmin Qu In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... such as the Coffin–Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011008.
Published Online: February 4, 2008
..., which focuses on the details of damage initiation and propagation in the individual solder ball. The local model is error seeded with voids based on cases selected in experiment. The damage propagation rate is monitored for all the cases. The technique used to quantify cyclic creep-fatigue damage...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011001.
Published Online: January 31, 2008
... simulated analyses of creep, plastic, and plastic-creep behavior on the WLCSP assemblies. It is found that the temperature dwell is the most significant factor on the effects of shear strain range from these analyses. The effect of high temperature dwell on the shear strain range is larger than that of low...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... material testing system, with solder alloys subjected to a variety of complex load conditions: pure shearing at strain rates between 6.7 × 10 − 7 ∕ s and 1.3 × 10 − 1 ∕ s , creep at temperatures ranging from room temperature up to 125 ° C , and cyclic loading with frequencies of 0.001 Hz to 3 Hz . Biaxial...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 256–264.
Published Online: July 8, 2004
... data. The developed mapping methodology is employed to design alternate accelerated thermal cycles by matching the creep and plastic strain contributions to total inelastic strain accumulation in solder under military field-use and accelerated thermal cycling environments, while reducing the time...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
Published Online: April 30, 2004
... thermodynamics. A series of uniaxial tension, tensile creep, and strain-controlled fatigue experiments are performed to obtain material parameters for the solder damage model. The solder damage model is then implemented into a finite element code and used to simulate a uniaxial tension test on a miniature...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 531–538.
Published Online: December 15, 2003
...S. Wiese; E. Meusel The creep and crack propagation behavior of SnAg3.5, SnAg4Cu0.5, and SnPb37 (as reference) was investigated on flip chip solder joints V = 1 × 10 − 12 m 3 . The test specimen consisted of two silicon chips (3.3×3.3 mm), bonded to each other by four flip chip joints (one on each...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
Published Online: December 15, 2003
...) simulations using isotropic and anisotropic properties of the die are carried out, respectively, and the results are compared. Creep experiments were performed at different temperatures ranging from −65°C to 230°C to obtain the long-term master curves and the related shift factors for the creep compliance...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 562–568.
Published Online: December 15, 2003
..., assumptions concerning the homogeneity of the cyclic temperature fields, simplified creep characterization of solder, and the related application of Manson-Coffin failure criteria, are discussed in the paper. The packages chosen for detailed analyses are a PBGA 272 and a FC-CSP 230. Contributed...