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Keywords: crack-edge stress field analysis
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Journal Articles

Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

Bingzhi Su, Y. C. Lee, Martin L. Dunn
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 369–377.
DOI: https://doi.org/10.1115/1.1602702
Published Online: September 17, 2003
... . Manuscript received May 2002. Associate Editor: Z. Suo. 01 May 2002 17 09 2003 gallium arsenide III-V semiconductors brittle fracture crack-edge stress field analysis soldering indium lead packaging finite element analysis Gallium arsenide (GaAs) semiconductors...
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Topics: Corners (Structural elements), Fracture (Materials), Fracture (Process), Gallium arsenide, Geometry, Solders, Stress, Brittleness, Temperature, Finite element analysis
Journal Articles

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

A. Q. Xu, H. F. Nied
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 301–305.
DOI: https://doi.org/10.1115/1.1289768
Published Online: December 1, 2000
.... Shiratori. flip-chip devices chip-on-board packaging integrated circuit packaging plastic packaging integrated circuit reliability failure analysis thermal stress cracking crack-edge stress field analysis delamination finite element analysis Semiconductor packaging requirements...
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Topics: Corners (Structural elements), Delamination, Epoxy adhesives, Epoxy resins, Finite element analysis, Fracture (Materials), Silicon, Stress, Stress singularity, Geometry
Journal Articles

A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate

C. Y. Hui, H. D. Conway, Y. Y. Lin
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 267–273.
DOI: https://doi.org/10.1115/1.1287930
Published Online: September 1, 2000
... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: B. Michel. thin films multilayers internal stresses fracture mechanics stress-strain relations crack-edge stress field analysis Many engineering devices are constructed by bonding...
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Topics: Stress, Thin films, Fracture (Materials), Composite materials, Residual stresses, Deformation
Journal Articles

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

John H. Lau, ASME Fellow, S.-W. Ricky Lee, ASME Member
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 306–310.
DOI: https://doi.org/10.1115/1.1289998
Published Online: June 20, 2000
... mechanics circuit reliability printed circuits plastic deformation thermal stress cracking crack-edge stress field analysis delamination soldering finite element analysis The last decade witnessed an explosive growth in the research and development efforts devoted to solder bumped flip chips...
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Topics: Corners (Structural elements), Delamination, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture mechanics, Solder joints, Solder masks, Solders, Stress
Journal Articles

Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

T. Elperin, A. Kornilov, G. Rudin
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 317–322.
DOI: https://doi.org/10.1115/1.1289635
Published Online: August 9, 1999
... for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD August 9, 1999; revised manuscript received April 13, 2000. Associated Technical Editor: B. Michel. 09 August 1999 integrated circuit technology thermal stress cracking crack-edge stress field analysis...
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Topics: Microcracks, Semiconductor wafers, Separation (Technology), Temperature, Laser beams, Sprays, Elasticity, Stress, Temperature distribution, Relaxation (Physics)