...) of δ . The distributed forces acting on the edges of the die are resolved into the direction of δ . 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer...

... and with the temperature degrading at the same pressure. In the COG packaging with NCF, a proper elevating of the bonding temperature could produce a stable direct connection with the low contact resistance. 24 02 2010 24 09 2010 03 12 2010 03 12 2010 chip-on-board packaging contact resistance...

.../ACFs) or the nonconductive adhesives/films (NCAs/NCFs), and the former is more widely used than the latter. nonconductive film (NCF) chip on glass (COG) warpage the thermocompression bonding chip-on-board packaging thermal stresses 08 11 2008 26 05 2008 29 10 2009...

... 2004 15 November 2004 03 06 2005 chip-on-board packaging integrated circuit packaging light interferometry integrated circuit testing integrated circuit reliability integrated circuit interconnections flip-chip devices failure analysis thermal analysis delamination adhesive...

... Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received October 24, 2004; revision received May 17, 2004. Review conducted by: C. Basaran. 24 October 2004 17 May 2004 03 06 2005 ceramic packaging strain ageing chip-on-board packaging integrated...

... have an increasing selection of possible flip chip assembly processes, based primarily on cost, reliability and complexity. flip-chip devices integrated circuit packaging adhesives chip scale packaging adhesive bonding encapsulation integrated circuit reliability chip-on-board packaging...

... ball grid arrays plastic packaging chip-on-board packaging flip-chip devices integrated circuit packaging thermal management (packaging) thermal conductivity natural convection forced convection thermal resistance Flip-chip plastic ball grid array (FC-PBGA) packages are fast becoming...

... employing epoxy resin filled between chip and FR4 substrate, comparing with using ceramic substrate only. J -integral Flip-chip Interfacial delamination Crack propagation Finite element simulation cracks inspection failure analysis chip-on-board packaging flip-chip devices...

... lead alloys flip-chip devices chip-on-board packaging soldering thermal stress cracking plastic deformation acoustic microscopy inspection finite element analysis viscoelasticity viscoplasticity thermal expansion shear deformation interface phenomena modelling The development...

... 20, 2002. Associate Editor: A. Tay. 01 April 2001 20 April 2002 12 12 2002 encapsulation flip-chip devices chip-on-board packaging integrated circuit packaging plastic packaging polymer films heat treatment differential scanning calorimetry The reliability...

..., due to stresses caused by the underfill swelling. Optimizing the choice of the underfill is thus crucial to the reliability of FCOB assemblies. flip-chip devices chip-on-board packaging reflow soldering swelling environmental degradation viscoplasticity life testing finite element...

.... Shiratori. flip-chip devices chip-on-board packaging integrated circuit packaging plastic packaging integrated circuit reliability failure analysis thermal stress cracking crack-edge stress field analysis delamination finite element analysis Semiconductor packaging requirements...

... Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters October 10, 2000. Associate Editor: J. Lau 10 October 2000 flip-chip devices chip-on-board packaging chip scale packaging...

... can be further determined. A flip-chip-on-board package was used as a test vehicle. Its structure is shown in Fig. 6 . The underfill material is silica-filled epoxy which was dispensed at 85°C and cured at 150°C for 60 minutes after soldering reflow. The PCB board was cut and ground...

... agreement. [S1043-7398(00)00101-8] semiconductor device packaging flow simulation finite element analysis microprocessor chips compressible flow encapsulation viscosity chip-on-board packaging Semiconductor chips are often encapsulated with an epoxy-molding compound (EMC) for protection...