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Keywords: chip-on-board packaging
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041013.
Published Online: December 8, 2010
... 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder wetting dynamics While next generation flip chip processing holds many...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041008.
Published Online: October 29, 2009
.../ACFs) or the nonconductive adhesives/films (NCAs/NCFs), and the former is more widely used than the latter. nonconductive film (NCF) chip on glass (COG) warpage the thermocompression bonding chip-on-board packaging thermal stresses 08 11 2008 26 05 2008 29 10 2009...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 29–32.
Published Online: March 21, 2005
... have an increasing selection of possible flip chip assembly processes, based primarily on cost, reliability and complexity. flip-chip devices integrated circuit packaging adhesives chip scale packaging adhesive bonding encapsulation integrated circuit reliability chip-on-board packaging...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
Published Online: January 24, 2005
... and/or by increasing heat area in that path. A brief review of the past work follows. ball grid arrays plastic packaging chip-on-board packaging flip-chip devices integrated circuit packaging thermal management (packaging) thermal conductivity natural convection forced convection thermal resistance...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 94–99.
Published Online: April 30, 2004
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Oct. 2003. Associate Editor: Z. Suo. 01 Oct 2003 30 04 2004 cracks inspection failure analysis chip-on-board packaging flip-chip devices fracture mechanics delamination acoustic microscopy finite element analysis J...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 84–92.
Published Online: March 14, 2003
... has a smaller CTE, a higher Young modulus and a higher glass transition temperature 3 4 . tin alloys lead alloys flip-chip devices chip-on-board packaging soldering thermal stress cracking plastic deformation acoustic microscopy inspection finite element analysis viscoelasticity...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 391–396.
Published Online: December 12, 2002
... 2002 12 12 2002 encapsulation flip-chip devices chip-on-board packaging integrated circuit packaging plastic packaging polymer films heat treatment differential scanning calorimetry The reliability of flip chip on board (FCOB) samples is greatly increased by the introduction...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 184–187.
Published Online: July 26, 2002
...-on-board packaging reflow soldering swelling environmental degradation viscoplasticity life testing finite element analysis ageing thermal stress cracking integrated circuit interconnections The direct attachment of a flip chip die to an organic substrate with eutectic (63Sn/37Pb) solder...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 301–305.
Published Online: December 1, 2000
... for minimizing edge stresses in IC packages are presented. [S1043-7398(00)00904-X] Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associated Technical Editor: M. Shiratori. flip-chip devices chip-on-board packaging integrated...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 196–199.
Published Online: March 21, 2000
.... Schmidt. 10 September 1999 21 March 2000 flip-chip devices chip-on-board packaging plastic packaging curvature measurement measurement by laser beam finite element analysis thermal expansion bending heat treatment Controlling surface warpage of electronic packages...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 20–27.
Published Online: August 17, 1999
... compressible flow encapsulation viscosity chip-on-board packaging Semiconductor chips are often encapsulated with an epoxy-molding compound (EMC) for protection and optimal use of the chip 1 . For better mold design and optimization of processing, numerical flow analysis during the encapsulation...