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Keywords: antenna-in-package
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Journal Articles
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
Published Online: March 20, 2023
...Xuesong Zhang; Qian Wang; Chenhui Xia; Chaojie Zhou; Gang Wang; Jian Cai The technology of fan-out wafer level packaging (FOWLP) has been widely adopted for millimeter wave antenna-in-package (AiP) system integration with low interconnection parasitic parameters. Present AiP solutions using FOWLP...