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Keywords: Thermal and Mechanical Loading
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 83–87.
Published Online: April 10, 2000
... as indicator of package reliability. 10 April 2000 plastic packaging circuit reliability flip-chip devices heat sinks design of experiments thermal stress cracking mechanical testing finite element analysis inspection Flip Chip Deformation Thermal and Mechanical Loading...
