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Keywords: SnAgCu
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
Published Online: March 1, 2015
... with experimental data. high strain rate lead-free solder SnAgCu Electronic products are generally subjected to high-G loads in shock and vibration environments. The second-level solder interconnects bear a considerable portion of the deformation load subjected on the printed circuit board during...
