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Keywords: Numerical Simulation
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
Published Online: May 19, 2022
... performance. Ryu [ 31 ] carried out a three-dimensional numerical simulation and investigated the sensitivity of design parameters to improve the manifold microchannel thermal and hydraulic performance. Boteler [ 32 ] used computational analysis to study the impact of manifold microchannel width, microchannel...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021007.
Paper No: EP-13-1082
Published Online: April 29, 2014
... of 34 kPa as compared to a temperature variation of 38 K and a pressure drop of 144 kPa with continuous fins and 51 K and 21 kPa for a smooth flow channel. 3D IC electronics cooling numerical simulation temperature nonuniformity pressure drop High heat flux removal from evolving IC...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041007.
Paper No: EP-13-1018
Published Online: November 5, 2013
..., 2013. Assoc. Editor: Susan Lu. 06 03 2013 26 08 2013 A design of experiment (DOE) methodology based on numerical simulation is presented to improve thermal fatigue reliability of multirow quad flat nonlead (QFN) packages. In this method, the influences of material properties...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041010.
Published Online: December 6, 2012
... microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty. transversal wavy microchannel pressure drop overall thermal resistance numerical simulation...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
Published Online: April 1, 2009
... numerical simulation surrogate method optimization The ever-growing demands for handling high heat flux and trends toward miniaturization have encouraged intensive research in the field of microcooling technology. The limitations of space in microdevices and power to drive cooling devices have...
Journal Articles
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 200–210.
Published Online: September 3, 1999
... to ensure accurate grid converged steady temperature and relative humidity solutions for the present configuration. 4 Schematic drawing of a double wall metallic cabinet utilized in the experiments and details of the selected mesh for the numerical simulations The numerical results were...