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Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. September 2022, 144(3): 031017.

Paper No: EP-21-1164

https://doi.org/10.1115/1.4054461

Published Online: May 19, 2022

... performance. Ryu [ 31 ] carried out a three-dimensional numerical simulation and investigated the sensitivity of design parameters to improve the manifold microchannel thermal and hydraulic performance. Boteler [ 32 ] used computational analysis to study the impact of manifold microchannel width, microchannel...

View Article titled, Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer

Journal Articles

Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated Circuits

Daniel Lorenzini-Gutierrez, Satish G. Kandlikar

J. Electron. Packag. June 2014, 136(2): 021007.

Paper No: EP-13-1082

https://doi.org/10.1115/1.4027091

Published Online: April 29, 2014

... of 34 kPa as compared to a temperature variation of 38 K and a pressure drop of 144 kPa with continuous fins and 51 K and 21 kPa for a smooth flow channel. 3D IC electronics cooling numerical simulation temperature nonuniformity pressure drop High heat flux removal from evolving IC...

View Article titled, Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated Circuits

Topics: Density, Flow (Dynamics), Pressure drop, Temperature, Cooling, Fins

Journal Articles

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Guofeng Xia, Fei Qin, Cha Gao, Tong An, Wenhui Zhu

J. Electron. Packag. December 2013, 135(4): 041007.

Paper No: EP-13-1018

https://doi.org/10.1115/1.4025597

Published Online: November 5, 2013

..., 2013. Assoc. Editor: Susan Lu. 06 03 2013 26 08 2013 A design of experiment (DOE) methodology based on numerical simulation is presented to improve thermal fatigue reliability of multirow quad flat nonlead (QFN) packages. In this method, the influences of material properties...

View Article titled, Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Topics: Cycles, Design, Fatigue, Fatigue life, Reliability, Solder joints, Temperature, Materials properties, Stress, Taguchi methods

Journal Articles

Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

Gongnan Xie, Jian Liu, Weihong Zhang, Bengt Sunden

J. Electron. Packag. December 2012, 134(4): 041010.

https://doi.org/10.1115/1.4023035

Published Online: December 6, 2012

... microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty. transversal wavy microchannel pressure drop overall thermal resistance numerical simulation...

View Article titled, Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

Topics: Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Cooling, Reynolds number

Journal Articles

Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

Afzal Husain, Kwang-Yong Kim

J. Electron. Packag. June 2009, 131(2): 021005.

https://doi.org/10.1115/1.3103931

Published Online: April 1, 2009

... numerical simulation surrogate method optimization The ever-growing demands for handling high heat flux and trends toward miniaturization have encouraged intensive research in the field of microcooling technology. The limitations of space in microdevices and power to drive cooling devices have...

View Article titled, Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

Topics: Design, Heat sinks, Microchannels, Optimization, Thermal resistance, Heat transfer, Response surface methodology, Shapes, Flow (Dynamics), Computer simulation

Journal Articles

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Yen-Shu Chen, Kuo-Hsiang Chien, Chi-Chuan Wang, Tzu-Chen Hung, Yuh-Ming Ferng, Bau-Shei Pei

J. Electron. Packag. September 2007, 129(3): 348–355.

https://doi.org/10.1115/1.2753970

Published Online: December 19, 2006

.../0140-7007(90)90059-6 , 13 , pp. 286 – 292 . 28 08 2006 19 12 2006 conducting materials thermal conductivity thermal management (packaging) thermal resistance spreading resistance rectangular plate numerical simulation experimental investigation vapor chamber...

View Article titled, Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Topics: Heat, Heat conduction, Plates (structures), Temperature, Temperature distribution, Thermal resistance, Vapors, Heat transfer, Flat heat pipes, Computer simulation

Journal Articles

A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages

J. V. C. Vargas, G. Stanescu, R. Florea, M. C. Campos

J. Electron. Packag. September 2001, 123(3): 200–210.

https://doi.org/10.1115/1.1348337

Published Online: September 3, 1999

... to ensure accurate grid converged steady temperature and relative humidity solutions for the present configuration. 4 Schematic drawing of a double wall metallic cabinet utilized in the experiments and details of the selected mesh for the numerical simulations The numerical results were...

View Article titled, A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages

Topics: Electronic packages, Heat transfer, Temperature, Computer simulation, Heat, Heat flux, Optimization

Journal citation

NARROW

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated Circuits

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages

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Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated Circuits

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages

Journals

Conference Proceedings

eBooks

Resources

Opportunities

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