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Journal Articles

Spray Cooling of IGBT Devices

Robert G. Mertens, Louis Chow, Kalpathy B. Sundaram, R. Brian Cregger, Daniel P. Rini, Louis Turek, Benjamin A. Saarloos

J. Electron. Packag. September 2007, 129(3): 316–323.

DOI: https://doi.org/10.1115/1.2753937

Published Online: May 18, 2007

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Topics: Cooling, Heat flux, Sprays, Temperature, Water, Junctions, Cycles

Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

Mohamed-Nabil Sabry

J. Electron. Packag. September 2007, 129(3): 256–259.

DOI: https://doi.org/10.1115/1.2753908

Published Online: April 16, 2007

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Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability

Journal Articles

Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS

Mehmet Arik, Anant Setlur, Stanton Weaver, Deborah Haitko, James Petroski

J. Electron. Packag. September 2007, 129(3): 328–338.

DOI: https://doi.org/10.1115/1.2753958

Published Online: April 9, 2007

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Topics: Brightness (Photometry), Design, Heat, Light-emitting diodes, Phosphors, Silicones, Temperature, Thermal management, Temperature distribution, Packaging

Journal Articles

Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors

Robert Wadell, Yogendra K. Joshi, Andrei G. Fedorov

J. Electron. Packag. September 2007, 129(3): 291–299.

DOI: https://doi.org/10.1115/1.2753919

Published Online: March 28, 2007

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Topics: Flow (Dynamics), Heat, Heat flux, Heat transfer, Refrigeration, Temperature, Pressure drop, Refrigerants, Microchannels

Journal Articles

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Fang Liu, Guang Meng, Mei Zhao

J. Electron. Packag. September 2007, 129(3): 266–272.

DOI: https://doi.org/10.1115/1.2753910

Published Online: March 15, 2007

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Topics: Damping, Deflection, Dynamics (Mechanics), Springs, Viscoelasticity, Viscosity, Dynamic analysis

Journal Articles

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Yen-Shu Chen, Kuo-Hsiang Chien, Chi-Chuan Wang, Tzu-Chen Hung, Yuh-Ming Ferng, Bau-Shei Pei

J. Electron. Packag. September 2007, 129(3): 348–355.

DOI: https://doi.org/10.1115/1.2753970

Published Online: December 19, 2006

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Topics: Heat, Heat conduction, Plates (structures), Temperature, Temperature distribution, Thermal resistance, Vapors, Heat transfer, Flat heat pipes, Computer simulation

Journal Articles

Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

X. L. Xie, W. Q. Tao, Y. L. He

J. Electron. Packag. September 2007, 129(3): 247–255.

DOI: https://doi.org/10.1115/1.2753887

Published Online: December 13, 2006

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Topics: Cooling, Heat flux, Heat sinks, Heat transfer, Pressure drop, Temperature, Thermal resistance, Turbulence, Wall thickness, Water

Journal Articles

Simulations of Process-Induced Warpage During IC Encapsulation Process

Shiang-Yu Teng, Sheng-Jye Hwang

J. Electron. Packag. September 2007, 129(3): 307–315.

DOI: https://doi.org/10.1115/1.2753936

Published Online: December 11, 2006

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Topics: Shrinkage (Materials), Simulation, Warping, Temperature

Journal Articles

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

Luke M. Thompson, Michael R. Maughan, Karl K. Rink, Donald M. Blackketter, Robert R. Stephens

J. Electron. Packag. September 2007, 129(3): 300–306.

DOI: https://doi.org/10.1115/1.2753920

Published Online: November 29, 2006

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Topics: Finite element analysis, Glass, Stress, Wire, Manufacturing, Bridges (Structures), Cooling, Temperature

Journal Articles

Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects

Russell Whitenack, Chandra Desai, Mostafa Rassaian

J. Electron. Packag. September 2007, 129(3): 356–365.

DOI: https://doi.org/10.1115/1.2753981

Published Online: November 13, 2006

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Topics: Cycles, Design, Electronic packaging, Failure, Plasticity, Shapes, Solders

Journal Articles

Numerical Optimization of the Thermoelectric Cooling Devices

Boris Abramzon

J. Electron. Packag. September 2007, 129(3): 339–347.

DOI: https://doi.org/10.1115/1.2753959

Published Online: November 5, 2006

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Topics: Cooling, Optimization, Temperature, Thermoelectric coolers, Electric current

Journal Articles

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

D. H. Lee, Y. S. Chung, P. M. Ligrani

J. Electron. Packag. September 2007, 129(3): 221–228.

DOI: https://doi.org/10.1115/1.2753884

Published Online: October 30, 2006

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Topics: Flow (Dynamics), Flow separation, Flow visualization, Jets, Nozzles, Pressure, Fins, Temperature, Impingement cooling, Reynolds number

Journal Articles

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

Laura K. Frisk, Kati H. Kokko

J. Electron. Packag. September 2007, 129(3): 260–265.

DOI: https://doi.org/10.1115/1.2753909

Published Online: October 27, 2006

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Topics: Adhesives, Bonding, Flip-chip, Flip-chip devices, Particulate matter, Pressure, Reliability, Temperature, Failure, Delamination

Journal Articles

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

S. Radhakrishnan, G. Subbarayan, L. Nguyen, W. Mazotti

J. Electron. Packag. September 2007, 129(3): 229–235.

DOI: https://doi.org/10.1115/1.2753885

Published Online: October 22, 2006

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Topics: Epoxy adhesives, Epoxy resins, Uncertainty, Viscoelasticity, Temperature, Modeling, Lasers, Displacement

Journal Articles

Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation

Leila Jannesari Ladani, Abhijit Dasgupta

J. Electron. Packag. September 2007, 129(3): 273–277.

DOI: https://doi.org/10.1115/1.2753911

Published Online: September 8, 2006

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Topics: Ball-Grid-Array packaging, Creep, Damage, Durability, Finite element analysis, Modeling, Solders, Thermomechanics, Reliability, Solder joints

Journal Articles

A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results

Giulio Lorenzini, Simone Moretti

J. Electron. Packag. September 2007, 129(3): 324–327.

DOI: https://doi.org/10.1115/1.2756852

Published Online: August 31, 2006

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Topics: Computational fluid dynamics, Fins, Heat

Journal Articles

On-Wafer Capacitors Under Mechanical Stress

Päivi H. Karjalainen, Pekka Heino

J. Electron. Packag. September 2007, 129(3): 287–290.

DOI: https://doi.org/10.1115/1.2753918

Published Online: August 24, 2006

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Topics: Capacitors, Semiconductor wafers, Stress, Complementary metal oxide semiconductors

Journal Articles

Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors

Brent L. Weight, Christopher A. Mattson, Spencer P. Magleby, Larry L. Howell

J. Electron. Packag. September 2007, 129(3): 236–246.

DOI: https://doi.org/10.1115/1.2721080

Published Online: July 25, 2006

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Topics: Design, Engineering prototypes, Modeling, Optimization, Testing, Displacement, Manufacturing, Deflection, Wear

Journal Articles

Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

Gang Chen, Xu Chen, Kwang Soo Kim, Mohammad Abdel-Karim, Masao Sakane

J. Electron. Packag. September 2007, 129(3): 278–286.

DOI: https://doi.org/10.1115/1.2753917

Published Online: July 20, 2006

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Topics: Constitutive equations, Hardening, Kinematics, Shear (Mechanics), Solders, Stress, Deformation

Journal Articles

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Woon-Seong Kwon, Hyoung-Joon Kim, Kyung-Wook Paik, Se-Young Jang, Soon-Min Hong

J. Electron. Packag. June 2004, 126(2): 202–207.

DOI: https://doi.org/10.1115/1.1756143

Published Online: July 8, 2004

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Topics: Adhesion, Aluminum, Cycles, Damage, Delamination, Dielectric materials, Displacement, Flip-chip packages, Fracture (Materials), Fracture (Process)

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Journal citation

NARROW

Spray Cooling of IGBT Devices

Flexible Profile Compact Thermal Models for Practical Geometries

Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS

Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

Simulations of Process-Induced Warpage During IC Encapsulation Process

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects

Numerical Optimization of the Thermoelectric Cooling Devices

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation

A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results

On-Wafer Capacitors Under Mechanical Stress

Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors

Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

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