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Journal Articles

Computational Framework for CFD Analysis of Loop Thermosiphon Based Embedded Cooling Systems

Accepted Manuscript
Caner Ekin Kiper, Ignacio Gallego-Marcos, Stevin Van Wyk, Yigit Akkus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1110
https://doi.org/10.1115/1.4068209
Published Online: March 17, 2025
View Article titled, Computational Framework for CFD Analysis of Loop Thermosiphon Based Embedded Cooling Systems
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Topics: Computational fluid dynamics, Cooling systems, Simulation, Relaxation (Physics), Engineers, Modeling, Stability, Computer cooling, Density, Flat heat pipes
Journal Articles

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Qi Jin, John T. Wen, Shankar Narayanan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041102.
Paper No: EP-21-1081
https://doi.org/10.1115/1.4051942
Published Online: August 20, 2021
View Article titled, Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control
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Topics: Compressors, Design, Flow (Dynamics), Heat, Oscillations, Pressure drop, Secondary cells, Stability, Stress, Valves
Journal Articles

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Manny X. de Jesús-López, Pedro O. Quintero, Lauren M. Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031110.
Paper No: EP-20-1013
https://doi.org/10.1115/1.4047063
Published Online: May 13, 2020
View Article titled, Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles
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Topics: Cycles, Melting, Metals, Solidification, Temperature, Alloys, Stability
Journal Articles

Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Tom Saenen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010901.
Paper No: EP-15-1091
https://doi.org/10.1115/1.4032490
Published Online: March 10, 2016
View Article titled, Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities
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Topics: Flow (Dynamics), Heat conduction, Microchannels, Algorithms, Simulation, Stability
Journal Articles

Vacuum Packaging of MEMS by Self-Assembly

Royi Naveh, Eyal Zussman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021003.
https://doi.org/10.1115/1.4006138
Published Online: June 11, 2012
View Article titled, Vacuum Packaging of MEMS by Self-Assembly
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Topics: Cavities, Self-assembly, Solders, Vacuum, Sealing (Process), Manufacturing, Stability, Surface tension, Microelectromechanical systems, Shear (Mechanics)
Journal Articles

Steady-State Behavior of a Three-Dimensional Pool-Boiling System

Michel Speetjens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041102.
https://doi.org/10.1115/1.2993147
Published Online: November 13, 2008
View Article titled, Steady-State Behavior of a Three-Dimensional Pool-Boiling System
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Topics: Bifurcation, Boiling, Cooling, Fluids, Heat, Heat flux, Pool boiling, Steady state, Temperature, Heat transfer
Journal Articles

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

Yasin Makwana, Dereje Agonafer, Fellow ASME, Dan Manole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 554–559.
https://doi.org/10.1115/1.1827272
Published Online: January 24, 2005
View Article titled, Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System
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Topics: Compressors, Refrigeration, Temperature, Stress, Computers, Stability, Vapors, Valves
Journal Articles

Computer Simulation of Solder Bridging Phenomena

T. J. Singler, Xu Zhang, K. A. Brakke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 122–126.
https://doi.org/10.1115/1.2792141
Published Online: September 1, 1996
View Article titled, Computer Simulation of Solder Bridging Phenomena
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Topics: Computer simulation, Solders, Bridges (Structures), Liquid metals, Stability, Equilibrium (Physics)
Journal Articles

Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

M. K. Schwiebert
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 89–91.
https://doi.org/10.1115/1.2905510
Published Online: June 1, 1994
View Article titled, Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff
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Topics: Solder joints, Stability, Surface mount packaging, Solders, Rocks, Surface mount technology
Journal Articles

Application of an Epoxy Cap in a Flip-Chip Package Design

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 16–20.
https://doi.org/10.1115/1.3226501
Published Online: March 1, 1989
View Article titled, Application of an Epoxy Cap in a Flip-Chip Package Design
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Topics: Design, Epoxy adhesives, Epoxy resins, Flip-chip packages, Stress, Buckling, Thermal expansion, Compression, Diluents, Low temperature