Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 40

Sort by

Sort Order Select

Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. June 2023, 145(2): 021001.

Paper No: EP-22-1003

DOI: https://doi.org/10.1115/1.4054972

Published Online: August 8, 2022

View Article

Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)

Journal Articles

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia

J. Electron. Packag. June 2021, 143(2): 020904.

Paper No: EP-20-1119

DOI: https://doi.org/10.1115/1.4049928

Published Online: March 5, 2021

View Article

Topics: Boiling, Coolants, Cooling, Data centers, Density, Flow (Dynamics), Fluids, Heat flux, Heat transfer coefficients, Plates (structures)

Journal Articles

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Rajesh Kasukurthy, Amruthavalli Rachakonda, Dereje Agonafer

J. Electron. Packag. September 2021, 143(3): 031001.

Paper No: EP-20-1016

DOI: https://doi.org/10.1115/1.4049018

Published Online: January 19, 2021

View Article

Topics: Computational fluid dynamics, Coolants, Cooling, Flow (Dynamics), Flow control, Matlab, Optimization, Plates (structures), Temperature, Testing

Journal Articles

Liquid Cooling of Compute System

Jessica Gullbrand, Mark J. Luckeroth, Mark E. Sprenger, Casey Winkel

J. Electron. Packag. March 2019, 141(1): 010802.

Paper No: EP-18-1054

DOI: https://doi.org/10.1115/1.4042802

Published Online: March 1, 2019

View Article

Topics: Cooling, Design, Fluids, Plates (structures), Flow (Dynamics), Manifolds, Temperature

Journal Articles

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler

J. Electron. Packag. March 2016, 138(1): 010906.

Paper No: EP-15-1094

DOI: https://doi.org/10.1115/1.4032493

Published Online: March 10, 2016

View Article

Topics: Gaskets, Geometry, Heat, Manifolds, Reliability, Silicon, Stress, Topology, Vehicles, Warping

Journal Articles

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Rui Zhang, Jian Cai, Qian Wang, Jingwei Li, Yang Hu, Hongda Du, Liangliang Li

J. Electron. Packag. March 2014, 136(1): 011012.

Paper No: EP-13-1045

DOI: https://doi.org/10.1115/1.4026616

Published Online: February 18, 2014

View Article

Topics: Electronics, Solders, Thermal resistance, Tin, Plates (structures), Lasers

Journal Articles

Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates

C. Y. Khor, M. Z. Abdullah, M. Abdul Mujeebu

J. Electron. Packag. March 2012, 134(1): 011003.

DOI: https://doi.org/10.1115/1.4005914

Published Online: March 19, 2012

View Article

Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Non-Newtonian flow, Plates (structures), Fluids, Simulation, Computational fluid dynamics, Finite volume methods, Pressure drop

Journal Articles

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

D. Sujan, Dereje E. Woldemichael, M. V. V. Murthy, K. N. Seetharamu

J. Electron. Packag. December 2011, 133(4): 041014.

DOI: https://doi.org/10.1115/1.4005294

Published Online: December 21, 2011

View Article

Topics: Manufacturing, Plates (structures), Shear (Mechanics), Shear stress, Solders, Stress, Temperature, Die cutting, Shearing (Deformation), Copper

Journal Articles

Squeezing Flow of a Power Law Fluid Between Grooved Plates

Drew A. Davidson, Bahgat G. Sammakia

J. Electron. Packag. September 2009, 131(3): 031007.

DOI: https://doi.org/10.1115/1.3144158

Published Online: June 23, 2009

View Article

Topics: Flow (Dynamics), Fluids, Microchannels, Plates (structures), Flat plates

Journal Articles

Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System

Cheng-Wei Tien, Kun-Huang Yu, Wen-Junn Sheu, Chi-Chuan Wang

J. Electron. Packag. June 2009, 131(2): 024501.

DOI: https://doi.org/10.1115/1.3103940

Published Online: March 27, 2009

View Article

Topics: Heating, Plates (structures), Refrigerants, Stress, Cooling, Vapors, Superheating, Two-phase flow, Pressure drop, Pressure

Journal Articles

Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance

Yen-Shu Chen, Kuo-Hsiang Chien, Yung-Shin Tseng, Yea-Kuang Chan

J. Electron. Packag. March 2009, 131(1): 011004.

DOI: https://doi.org/10.1115/1.3068299

Published Online: February 11, 2009

View Article

Topics: Approximation, Heat, Heat sinks, Plates (structures), Thermal conductivity, Thermal resistance, Temperature distribution, Heat conduction, Design

Journal Articles

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Yen-Shu Chen, Kuo-Hsiang Chien, Chi-Chuan Wang, Tzu-Chen Hung, Yuh-Ming Ferng, Bau-Shei Pei

J. Electron. Packag. September 2007, 129(3): 348–355.

DOI: https://doi.org/10.1115/1.2753970

Published Online: December 19, 2006

View Article

Topics: Heat, Heat conduction, Plates (structures), Temperature, Temperature distribution, Thermal resistance, Vapors, Heat transfer, Flat heat pipes, Computer simulation

Journal Articles

A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps

Chyi-Lang Lai, Wen-Bin Young

J. Electron. Packag. June 2004, 126(2): 186–194.

DOI: https://doi.org/10.1115/1.1649244

Published Online: July 8, 2004

View Article

Topics: Flow (Dynamics), Flow simulation, Permeability, Plates (structures), Porous materials, Simulation, Solders, Shapes, Cylinders

Journal Articles

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Ning Zheng, R. A. Wirtz

J. Electron. Packag. March 2004, 126(1): 1–7.

DOI: https://doi.org/10.1115/1.1646419

Published Online: April 30, 2004

View Article

Topics: Design, Engineering prototypes, Heat, Heat sinks, Latent heat, Storage, Temperature, Thermal conductivity, Thermal energy storage, Interfacial thermal resistance

Journal Articles

Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

Hideo Koguchi, Chie Sasaki, Kazuto Nishida

J. Electron. Packag. September 2003, 125(3): 414–419.

DOI: https://doi.org/10.1115/1.1602705

Published Online: September 17, 2003

View Article

Topics: Deflection, Temperature, Finite element methods, Plates (structures)

Journal Articles

Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection

Adrian Bejan, Fellow ASME, J. A. Jones Professor of Mechanical Engineering,

J. Electron. Packag. June 2003, 125(2): 200–207.

DOI: https://doi.org/10.1115/1.1566970

Published Online: June 10, 2003

View Article

Topics: Boundary layers, Cooling, Flow (Dynamics), Forced convection, Heat, Natural convection, Temperature, Fluids, Design, Plates (structures)

Journal Articles

Heat Transfer and Flow Friction Characteristics for Compact Cold Plates

Chang-Yuan Liu, Graduate Student, Ying-Huei Hung, Professor and Chairman, Mem. ASME

J. Electron. Packag. March 2003, 125(1): 104–113.

DOI: https://doi.org/10.1115/1.1536170

Published Online: March 14, 2003

View Article

Topics: Flow (Dynamics), Heat transfer, Plates (structures), Temperature, Thermal resistance, Heat flux, Pressure drop, Friction, Heat, Reynolds number

Journal Articles

Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending

Yibin Xue, Vivek A. Jairazbhoy, Xiaoting Niu, Jianmin Qu, Fellow ASME

J. Electron. Packag. March 2003, 125(1): 53–58.

DOI: https://doi.org/10.1115/1.1527892

Published Online: March 14, 2003

View Article

Topics: Boundary-value problems, Deflection, Deformation, Finite element analysis, Plates (structures)

Journal Articles

A Simple Technique for Maximizing the Fundamental Frequency of Vibrating Structures

J. H. Ong, G. H. Lim

J. Electron. Packag. December 2000, 122(4): 341–349.

DOI: https://doi.org/10.1115/1.1289632

Published Online: February 25, 2000

View Article

Topics: Boundary-value problems, Mode shapes, Optimization, Printed circuit boards, Vibration, Finite element analysis, Cantilevers, Algorithms, Density, Plates (structures)

Journal Articles

Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

Y. Asako, Y. Yamaguchi, M. Faghri

J. Electron. Packag. September 1999, 121(3): 202–208.

DOI: https://doi.org/10.1115/1.2792685

Published Online: September 1, 1999

View Article

Topics: Flow (Dynamics), Heat transfer, Ducts, Reynolds number, Computation, Flow visualization, Fluid dynamics, Numerical analysis, Plates (structures), Prandtl number

Journal citation

NARROW

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Liquid Cooling of Compute System

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

Squeezing Flow of a Power Law Fluid Between Grooved Plates

Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System

Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection

Heat Transfer and Flow Friction Characteristics for Compact Cold Plates

Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending

A Simple Technique for Maximizing the Fundamental Frequency of Vibrating Structures

Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only