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Journal Articles

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Xin Wei, Sa'd Hamasha, Ali Alahmer, Mohamed El Amine Belhadi

J. Electron. Packag. September 2023, 145(3): 031005.

Paper No: EP-22-1066

DOI: https://doi.org/10.1115/1.4056559

Published Online: January 27, 2023

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Topics: Ball-Grid-Array packaging, Cycles, Fatigue, Finishes, Solder joints, Stress, Fatigue life, Solders, Alloys

Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink

J. Electron. Packag. June 2023, 145(2): 020801.

Paper No: EP-22-1045

DOI: https://doi.org/10.1115/1.4055774

Published Online: October 22, 2022

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Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling

Journal Articles

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib

J. Electron. Packag. June 2023, 145(2): 021007.

Paper No: EP-22-1044

DOI: https://doi.org/10.1115/1.4055318

Published Online: September 28, 2022

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Topics: Alloys, Fatigue, Shear (Mechanics), Shear strength, Solders, Tin, Stress, Solder joints, Fatigue testing, Fatigue life

Journal Articles

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

Tae-Yong Park, Hyun-Ung Oh

J. Electron. Packag. March 2022, 144(1): 011006.

Paper No: EP-20-1108

DOI: https://doi.org/10.1115/1.4050512

Published Online: August 6, 2021

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Topics: Fatigue life, Random vibration, Safety, Solder joints, Ball-Grid-Array packaging

Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. March 2022, 144(1): 011007.

Paper No: EP-20-1120

DOI: https://doi.org/10.1115/1.4050871

Published Online: August 6, 2021

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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength

Journal Articles

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer

J. Electron. Packag. December 2020, 142(4): 041001.

Paper No: EP-20-1010

DOI: https://doi.org/10.1115/1.4048109

Published Online: August 27, 2020

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Topics: Fatigue life, Shear (Mechanics), Stress, Fatigue, Solder joints, Cycles, Fatigue testing, Solders

Journal Articles

Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

Minghong Jian, Sinan Su, Sa'd Hamasha, Mohammad M. Hamasha, Atif Alkhazali

J. Electron. Packag. March 2021, 143(1): 011008.

Paper No: EP-19-1117

DOI: https://doi.org/10.1115/1.4047341

Published Online: June 23, 2020

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Topics: Alloys, Fatigue, Fatigue life, Solder joints, Solders, Stress, Cycles, Energy dissipation, Fatigue properties, Reliability

Journal Articles

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Zhiwen Chen, Zhao Zhang, Fang Dong, Sheng Liu, Li Liu

J. Electron. Packag. March 2021, 143(1): 011001.

Paper No: EP-19-1055

DOI: https://doi.org/10.1115/1.4047227

Published Online: June 4, 2020

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Topics: Artificial neural networks, Fatigue life, Finite element analysis, Modeling, Solder joints, Creep, Finite element model

Journal Articles

Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

Wan-Chun Chuang, Wei-Long Chen

J. Electron. Packag. March 2020, 142(1): 011007.

Paper No: EP-19-1042

DOI: https://doi.org/10.1115/1.4044489

Published Online: October 10, 2019

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Topics: Cycles, Fatigue life, Semiconductor wafers, Simulation models, Solders, Stress, Temperature, Creep, Assembly lines, Simulation results

Journal Articles

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Chia-Cheng Chang, Kuo-Ning Chiang

J. Electron. Packag. March 2020, 142(1): 011005.

Paper No: EP-19-1027

DOI: https://doi.org/10.1115/1.4044278

Published Online: September 19, 2019

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Topics: Design, Fatigue life, High cycle fatigue, Microelectromechanical systems, Silicon-on-insulator, Simulation, Stress, Torsion, Cycles, Damage

Journal Articles

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Mahsa Montazeri, Cody J. Marbut, David Huitink

J. Electron. Packag. September 2019, 141(3): 031011.

Paper No: EP-18-1099

DOI: https://doi.org/10.1115/1.4043480

Published Online: May 24, 2019

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Topics: Cycles, Damage, Reliability, Shear (Mechanics), Solders, Stress, Temperature, Fatigue life, Failure, Finite element analysis

Journal Articles

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Sinan Su, Francy John Akkara, Ravinder Thaper, Atif Alkhazali, Mohammad Hamasha, Sa'd Hamasha

J. Electron. Packag. December 2019, 141(4): 040802.

Paper No: EP-18-1117

DOI: https://doi.org/10.1115/1.4043405

Published Online: May 17, 2019

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Topics: Creep, Cycles, Damage, Failure, Fatigue, Fatigue life, Solder joints, Stress, Fracture (Materials), Solders

Journal Articles

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

Chia-Cheng Chang, Sheng-Da Lin, Kuo-Ning Chiang

J. Electron. Packag. September 2018, 140(3): 031008.

Paper No: EP-18-1004

DOI: https://doi.org/10.1115/1.4040297

Published Online: June 26, 2018

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Topics: Stress, High cycle fatigue, Displacement, Silicon, Thin films, Fatigue life

Journal Articles

Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint

Sinan Su, Nianjun Fu, Francy John Akkara, Sa'd Hamasha

J. Electron. Packag. September 2018, 140(3): 031005.

Paper No: EP-17-1107

DOI: https://doi.org/10.1115/1.4040105

Published Online: May 21, 2018

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Topics: Alloys, Fatigue life, Solder joints, Solders, Stress, Temperature, Cycles, Fatigue

Journal Articles

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Lei Shi, Lin Chen, David Wei Zhang, Evan Liu, Qiang Liu, Ching-I Chen

J. Electron. Packag. March 2018, 140(1): 011002.

Paper No: EP-17-1035

DOI: https://doi.org/10.1115/1.4038245

Published Online: March 2, 2018

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Topics: Density, Design, Finite element model, Packaging, Reliability, Semiconductor wafers, Solder joints, Solders, Stress, Fatigue life

Journal Articles

Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

Yansong Tan, Xin Li, Yunhui Mei, Gang Chen, Xu Chen

J. Electron. Packag. June 2016, 138(2): 021001.

Paper No: EP-15-1109

DOI: https://doi.org/10.1115/1.4032880

Published Online: March 23, 2016

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Topics: Fatigue, Fracture (Materials), Shear (Mechanics), Shear stress, Temperature, Creep, Fracture (Process), Fatigue life, Cycles

Journal Articles

Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling

Sa'd Hamasha, Peter Borgesen

J. Electron. Packag. June 2016, 138(2): 021002.

Paper No: EP-15-1128

DOI: https://doi.org/10.1115/1.4032881

Published Online: March 23, 2016

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Topics: Cycles, Solder joints, Fatigue life, Stress

Journal Articles

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Soud Farhan Choudhury, Leila Ladani

J. Electron. Packag. December 2015, 137(4): 041003.

Paper No: EP-14-1099

DOI: https://doi.org/10.1115/1.4031523

Published Online: September 25, 2015

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Topics: Cycles, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Geometry, Reliability, Integrated circuits, Intermetallic compounds

Journal Articles

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

R. I. Okereke, S. K. Sitaraman

J. Electron. Packag. September 2015, 137(3): 031006.

Paper No: EP-14-1030

DOI: https://doi.org/10.1115/1.4030065

Published Online: September 1, 2015

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Topics: Dimensions, Electrical resistance, Fatigue life, Manufacturing, Solders, Stress, Warping, Cycles, Signals, Thermomechanics

Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen

J. Electron. Packag. June 2015, 137(2): 021012.

Paper No: EP-14-1077

DOI: https://doi.org/10.1115/1.4029441

Published Online: June 1, 2015

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Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature

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Journal citation

NARROW

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

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