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Journal Articles

Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger

Omri Tayyara, Carlos Da Silva, Miad Nasr, Amir Assadi, Kshitij Gupta, Olivier Trescases, Cristina H. Amon

J. Electron. Packag. December 2020, 142(4): 041102.

Paper No: EP-20-1020

DOI: https://doi.org/10.1115/1.4047226

Published Online: June 4, 2020

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Topics: Design, Electric vehicles, Engineering simulation, Simulation, Heat, Temperature, MOSFET transistors, Inductors, Cooling, Circuits

Journal Articles

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

M. Baris Dogruoz

J. Electron. Packag. June 2016, 138(2): 021004.

Paper No: EP-16-1035

DOI: https://doi.org/10.1115/1.4033109

Published Online: April 19, 2016

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Topics: Electric fields, Heating, Joules, Printed circuit boards, Simulation, Temperature, Temperature distribution, Thermal conductivity, Engineering simulation

Journal Articles

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Wei Chen, Anirudh Bhat, Suresh K. Sitaraman

J. Electron. Packag. December 2015, 137(4): 041005.

Paper No: EP-14-1064

DOI: https://doi.org/10.1115/1.4031680

Published Online: October 12, 2015

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Topics: Displacement, Manufacturing, Polymers, Simulation, Testing, Accelerometers, Engineering simulation, Strain gages, Finite element analysis, Engineering prototypes

Journal Articles

Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

Etienne L. Bonnaud

J. Electron. Packag. December 2011, 133(4): 041013.

DOI: https://doi.org/10.1115/1.4005451

Published Online: December 19, 2011

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Topics: Engineering simulation, Failure, Hardening, Lead-free solders, Simulation, Solder joints, Solders, Stress, Finite element analysis

Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee

J. Electron. Packag. September 2011, 133(3): 031010.

DOI: https://doi.org/10.1115/1.4004861

Published Online: September 26, 2011

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Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat

Journal Articles

Modeling of Natural Convection in Electronic Enclosures

Peter M. Teertstra, M. Michael Yovanovich, J. Richard Culham

J. Electron. Packag. June 2006, 128(2): 157–165.

DOI: https://doi.org/10.1115/1.2188953

Published Online: September 28, 2005

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Topics: Boundary layers, Computational fluid dynamics, Convection, Engineering simulation, Heat conduction, Natural convection, Shapes, Simulation, Flow (Dynamics), Model validation

Journal Articles

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

L. J. Ernst, Guest Editor, G. Q. Zhang, Guest Editor

J. Electron. Packag. December 2003, 125(4): 465.

DOI: https://doi.org/10.1115/1.1634590

Published Online: December 15, 2003

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Topics: Engineering simulation, Microelectromechanical systems, Microelectronic devices, Optimization, Thermal management, Computer simulation, Failure analysis, Micromechanical devices, Packaging

Journal Articles

Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

M. Carmona, S. Marco, J. Samitier, M. C. Acero, J. A. Plaza, J. Esteve

J. Electron. Packag. December 2003, 125(4): 527–530.

DOI: https://doi.org/10.1115/1.1604154

Published Online: December 15, 2003

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Topics: Micropumps, Simulation, Finite element methods, Engineering simulation, Modeling, Membranes, Thermomechanics

Journal Articles

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. F. J. M. Caers

J. Electron. Packag. December 1999, 121(4): 237–241.

DOI: https://doi.org/10.1115/1.2793846

Published Online: December 1, 1999

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Topics: Durability, Flip-chip, Flip-chip devices, Solders, Thermomechanics, Fatigue, Finite element model, Solder joints, Architecture, Cycles

Journal Articles

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

L. Nguyen, C. Quentin, W. Lee, S. Bayyuk, S. A. Bidstrup-Allen, S.-T. Wang

J. Electron. Packag. June 2000, 122(2): 138–146.

DOI: https://doi.org/10.1115/1.483146

Published Online: September 21, 1999

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Topics: Cavities, Flow (Dynamics), Molding, Pressure, Simulation, Temperature, Transfer molding, Viscosity, Computer simulation, Computer software

Journal Articles

Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages

Y. Kondo, M. Behnia, W. Nakayama, H. Matsushima

J. Electron. Packag. September 1998, 120(3): 259–266.

DOI: https://doi.org/10.1115/1.2792631

Published Online: September 1, 1998

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Topics: Electronic packages, Heat sinks, Impingement cooling, Optimization, Computational fluid dynamics, Design, Cooling, Dimensions, Electronic components, Engineering simulation

Journal Articles

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

X. Wu, X. Dou, C.-P. Yeh, K. Waytt

J. Electron. Packag. June 1998, 120(2): 141–144.

DOI: https://doi.org/10.1115/1.2792601

Published Online: June 1, 1998

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Topics: Simulation, Solder joints, Solders, Geometry, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation

Journal Articles

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan

J. Electron. Packag. June 1998, 120(2): 118–122.

DOI: https://doi.org/10.1115/1.2792592

Published Online: June 1, 1998

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Topics: Design, Optimization, Shapes, Solders, Reliability, Fatigue life, Ball-Grid-Array packaging, Ceramics, Composite materials, Engineering simulation

Journal Articles

A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints

T. Reinikainen, M. Poech, M. Krumm, J. Kivilahti

J. Electron. Packag. March 1998, 120(1): 106–113.

DOI: https://doi.org/10.1115/1.2792277

Published Online: March 1, 1998

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Topics: Experimental analysis, Finite element analysis, Shear (Mechanics), Solder joints, Stress concentration, Creep, Simulation results, Stress, Alloys, Deformation

Journal Articles

Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models

G. Subbarayan, Y. Li, R. L. Mahajan

J. Electron. Packag. September 1996, 118(3): 148–156.

DOI: https://doi.org/10.1115/1.2792145

Published Online: September 1, 1996

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Topics: Artificial neural networks, Engineering simulation, Finite element analysis, Reliability, Simulation, Solder joints, Design, Manufacturing, Finite element model, Ball-Grid-Array packages

Journal Articles

Fine Pitch Stencil Printing Process Modeling and Optimization

Y. Li, R. L. Mahajan, N. Nikmanesh

J. Electron. Packag. March 1996, 118(1): 1–6.

DOI: https://doi.org/10.1115/1.2792121

Published Online: March 1, 1996

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Topics: Modeling, Optimization, Printing, Solders, Design, Neural network models, Algorithms, Assembly lines, Engineering simulation, Machinery

Journal Articles

Heat Transfer in Wire Bonding Process

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. March 1994, 116(1): 44–48.

DOI: https://doi.org/10.1115/1.2905492

Published Online: March 1, 1994

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Topics: Heat transfer, Wire bonding, Electrodes, Wire, Electric discharge, Electric fields, Electric potential, Engineering simulation, Flux (Metallurgy), Heat

Journal Articles

Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process

M. Eftychiou, T. L. Bergman, G. Y. Masada

J. Electron. Packag. March 1992, 114(1): 48–54.

DOI: https://doi.org/10.1115/1.2905441

Published Online: March 1, 1992

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Topics: Reflow soldering, Temperature effects, Engineering simulation, Manufacturing, Ovens, Radiative heat transfer, Simulation, Circuits, Computer simulation, Transient heat transfer

Journal Articles

Assembly Stiffness and Failure Criterion Considerations in Solder Joint Fatigue

J. R. Wilcox, R. Subrahmanyan, Che-Yu Li

J. Electron. Packag. June 1990, 112(2): 115–122.

DOI: https://doi.org/10.1115/1.2904351

Published Online: June 1, 1990

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Topics: Failure, Fatigue, Manufacturing, Solder joints, Stiffness, Damage, Displacement, Fatigue life, Deformation, Engineering simulation

Journal Articles

Strength Analysis of Surface Mounted Assemblies Under Bending and Twisting Loads

Tin-Lup Wong, Karl K. Stevens, Junshi Wang, Wayne Chen

J. Electron. Packag. June 1990, 112(2): 168–174.

DOI: https://doi.org/10.1115/1.2904358

Published Online: June 1, 1990

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Topics: Stress, Deflection, Deformation, Engineering simulation, Experimental analysis, Failure, Simulation, Simulation results

Journal citation

NARROW

Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

Modeling of Natural Convection in Electronic Enclosures

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

CBGA Solder Fillet Shape Prediction and Design Optimization

A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints

Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models

Fine Pitch Stencil Printing Process Modeling and Optimization

Heat Transfer in Wire Bonding Process

Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process

Assembly Stiffness and Failure Criterion Considerations in Solder Joint Fatigue

Strength Analysis of Surface Mounted Assemblies Under Bending and Twisting Loads

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