1-20 of 30
Corners (Structural elements)
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031007.
Paper No: EP-22-1070
https://doi.org/10.1115/1.4056886
Published Online: March 7, 2023
View Article titled, A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
Open the PDF for A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique in another window
Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011002.
Paper No: EP-19-1029
https://doi.org/10.1115/1.4044218
Published Online: August 1, 2019
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model
Open the PDF for Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model in another window
Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints
Journal Articles

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

P. Borgesen, D. Blass, M. Meilunas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011010.
https://doi.org/10.1115/1.4005904
Published Online: March 19, 2012
View Article titled, Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies
Open the PDF for Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies in another window
Topics: Ball-Grid-Array packaging, Bonding, Corners (Structural elements), Fracture (Materials), Solder joints, Solders, Cycles, Manufacturing, Cracking (Materials), Fracture (Process)
Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
https://doi.org/10.1115/1.4005956
Published Online: March 19, 2012
View Article titled, Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
Open the PDF for Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test in another window
Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin
Journal Articles

Dynamics Of Board-Level Drop Impact

E. H. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
https://doi.org/10.1115/1.1938987
Published Online: July 17, 2004
View Article titled, Dynamics Of Board-Level Drop Impact
Open the PDF for Dynamics Of Board-Level Drop Impact in another window
Topics: Corners (Structural elements), Deflection, Dynamics (Mechanics), Finite element analysis, Springs, Stress, Electronic packaging, Impact testing
Journal Articles

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Woon-Seong Kwon, Hyoung-Joon Kim, Kyung-Wook Paik, Se-Young Jang, Soon-Min Hong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 202–207.
https://doi.org/10.1115/1.1756143
Published Online: July 8, 2004
View Article titled, Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling
Open the PDF for Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling in another window
Topics: Adhesion, Aluminum, Cycles, Damage, Delamination, Dielectric materials, Displacement, Flip-chip packages, Fracture (Materials), Fracture (Process)
Journal Articles

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

A. A. O. Tay, K. H. Lee, K. M. Lim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 569–575.
https://doi.org/10.1115/1.1604803
Published Online: December 15, 2003
View Article titled, Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element
Open the PDF for Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element in another window
Topics: Boundary element methods, Delamination, Fracture (Materials), Stress, Corners (Structural elements), Stress analysis (Engineering)
Journal Articles

Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

Bingzhi Su, Y. C. Lee, Martin L. Dunn
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 369–377.
https://doi.org/10.1115/1.1602702
Published Online: September 17, 2003
View Article titled, Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities
Open the PDF for Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities in another window
Topics: Corners (Structural elements), Fracture (Materials), Fracture (Process), Gallium arsenide, Geometry, Solders, Stress, Brittleness, Temperature, Finite element analysis
Journal Articles

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki, Nobutaka Ito, Mami Nagatake, Mitsuru Sato
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 31–38.
https://doi.org/10.1115/1.1525244
Published Online: March 14, 2003
View Article titled, Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch
Open the PDF for Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch in another window
Topics: Absorption, Corners (Structural elements), Fracture (Materials), Molding resins, Reflow soldering, Stress, Vapor pressure, Diffusion (Physics), Finite element methods
Journal Articles

Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips

Sergey Shkarayev, Mem. ASME,, Sergey Savastiouk, Oleg Siniaguine
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 98–103.
https://doi.org/10.1115/1.1535932
Published Online: March 14, 2003
View Article titled, Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips
Open the PDF for Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips in another window
Topics: Design, Reliability, Stress, Electronic packages, Corners (Structural elements), Event history analysis, Solders
Journal Articles

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

Shiva P. Gadag, Susan K. Patra, Volkan Ozguz, Phillipe Marchand, Sadik Esener
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
https://doi.org/10.1115/1.1481894
Published Online: July 26, 2002
View Article titled, Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
Open the PDF for Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor in another window
Topics: Cables, Ceramics, Composite materials, Convection, Cooling, Design, Finite element analysis, Finite element model, Heat, Heat sinks
Journal Articles

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 212–220.
https://doi.org/10.1115/1.1462625
Published Online: July 26, 2002
View Article titled, A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints
Open the PDF for A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints in another window
Topics: Corners (Structural elements), Fracture (Materials), Solder joints, Fatigue, Density, Semiconductor wafers, Cycles
Journal Articles

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 69–76.
https://doi.org/10.1115/1.1400995
Published Online: May 2, 2002
View Article titled, Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board
Open the PDF for Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board in another window
Topics: Creep, Solder joints, Lead-free solders, Solders, Shear (Mechanics), Corners (Structural elements), Shear stress, Stress, Printed circuit board assemblies, Reliability
Journal Articles

Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering

Chia-Yu Fu, David L. McDowell, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 45–53.
https://doi.org/10.1115/1.1401737
Published Online: January 1, 2001
View Article titled, Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering
Open the PDF for Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering in another window
Topics: Cooling, Corners (Structural elements), Finite element analysis, Printed circuit boards, Stress, Stress analysis (Engineering), Temperature, Transients (Dynamics), Wave soldering, Copper
Journal Articles

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

A. Q. Xu, H. F. Nied
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 301–305.
https://doi.org/10.1115/1.1289768
Published Online: December 1, 2000
View Article titled, Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages
Open the PDF for Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages in another window
Topics: Corners (Structural elements), Delamination, Epoxy adhesives, Epoxy resins, Finite element analysis, Fracture (Materials), Silicon, Stress, Stress singularity, Geometry
Journal Articles

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

John H. Lau, ASME Fellow, S.-W. Ricky Lee, ASME Member
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 306–310.
https://doi.org/10.1115/1.1289998
Published Online: June 20, 2000
View Article titled, Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills
Open the PDF for Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills in another window
Topics: Corners (Structural elements), Delamination, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture mechanics, Solder joints, Solder masks, Solders, Stress
Journal Articles

Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis

John H. Lau, ASME Fellow, S.-W. Ricky Lee, ASME Member, Chris Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 311–316.
https://doi.org/10.1115/1.1289769
Published Online: May 29, 2000
View Article titled, Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis
Open the PDF for Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis in another window
Topics: Corners (Structural elements), Creep, Semiconductor wafers, Shear (Mechanics), Solder joints, Solders, Temperature, Finite element analysis, Reliability, Manufacturing
Journal Articles

A New Approach to Calculate Atomic Flux Divergence by Electromigration

K. Sasagawa, N. Nakamura, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 360–366.
https://doi.org/10.1115/1.2792647
Published Online: December 1, 1998
View Article titled, A New Approach to Calculate Atomic Flux Divergence by Electromigration
Open the PDF for A New Approach to Calculate Atomic Flux Divergence by Electromigration in another window
Topics: Electrodiffusion, Corners (Structural elements), Current density, Temperature, Computational methods
Journal Articles

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

J. Wang, Z. Qian, D. Zou, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 179–185.
https://doi.org/10.1115/1.2792617
Published Online: June 1, 1998
View Article titled, Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry
Open the PDF for Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry in another window
Topics: Creep, Finite element methods, Flip-chip packages, Interferometry, Modeling, Deformation, Displacement, Solders, Stress, Finite element analysis
Journal Articles

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 18–23.
https://doi.org/10.1115/1.2792279
Published Online: March 1, 1998
View Article titled, Shearing Deformation in Partial Areal Arrays: Analytical Results
Open the PDF for Shearing Deformation in Partial Areal Arrays: Analytical Results in another window
Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry