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Journal Articles

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041107.
Paper No: EP-24-1022
https://doi.org/10.1115/1.4065943
Published Online: July 26, 2024
View Article titled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
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Topics: Coating processes, Coatings, Copper, Plasma spraying, Spraying (Coating processes), Sprays, Surface roughness, Ceramics, Electronics, Experimental design
Journal Articles

A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules

Feifei Yan, Laili Wang, Yongmei Gan, Kaixuan Li, Boya Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031016.
Paper No: EP-21-1168
https://doi.org/10.1115/1.4053891
Published Online: March 11, 2022
View Article titled, A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules
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Topics: Ceramics, Electric fields, Electrodes, Silicones, Insulation
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011004.
Paper No: EP-20-1093
https://doi.org/10.1115/1.4049815
Published Online: August 6, 2021
View Article titled, Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
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Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature
Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Ardalan Nasiri, Simon Ang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020902.
Paper No: EP-20-1060
https://doi.org/10.1115/1.4049292
Published Online: February 22, 2021
View Article titled, Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
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Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum
Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041107.
Paper No: EP-19-1131
https://doi.org/10.1115/1.4047409
Published Online: June 26, 2020
View Article titled, Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
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Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)
Journal Articles

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun, Mingxiang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
https://doi.org/10.1115/1.4043645
Published Online: May 24, 2019
View Article titled, Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
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Topics: Cements (Adhesives), Ceramics, Dams, Manufacturing, Reliability, Shear strength, Low temperature, Molding, Temperature, Viscosity
Journal Articles

Gold-Tin Solder Wetting Behavior for Package Lid Seals

Paul T. Vianco, Alice C. Kilgo, Bonnie M. McKenzie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021003.
Paper No: EP-17-1115
https://doi.org/10.1115/1.4039749
Published Online: May 9, 2018
View Article titled, Gold-Tin Solder Wetting Behavior for Package Lid Seals
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Topics: Solders, Tin, Ceramics, Wetting, Contamination, Solder joints
Journal Articles

A Novel Ceramic Packaging Technique Using Selective Induction Heating

Sheng Liu, Wenming Liu, Changyong Lin, Mingxiang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041010.
https://doi.org/10.1115/1.4000366
Published Online: November 12, 2009
View Article titled, A Novel Ceramic Packaging Technique Using Selective Induction Heating
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Topics: Ceramics, Electromagnetic induction, Heating, Packaging, Temperature
Journal Articles

Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading

B. Wunderle, T. Braun, D. May, B. Michel, H. Reichl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011012.
https://doi.org/10.1115/1.3078187
Published Online: February 13, 2009
View Article titled, Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
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Topics: Capacitors, Ceramics, Fracture (Materials), Capacitance, Simulation
Journal Articles

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

M. A. Neidigk, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
https://doi.org/10.1115/1.3068298
Published Online: February 11, 2009
View Article titled, Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
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Topics: Ceramics, Coating processes, Coatings, Computer simulation, Cooling, Epoxy resins, Failure, Ferrites (Magnetic materials), Finite element analysis, Manufacturing
Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
View Article titled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
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Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints
Journal Articles

Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package

Andy Perkins, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011012.
https://doi.org/10.1115/1.2837520
Published Online: February 14, 2008
View Article titled, Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package
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Topics: Ceramics, Failure, Fatigue life, Solder joints, Solders, Vibration, Stress, Cycles, Vehicles, Finite element model
Journal Articles

High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure

Hong He, Renli Fu, Yanchun Han, Yuan Shen, Deliu Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 469–472.
https://doi.org/10.1115/1.2804097
Published Online: April 4, 2007
View Article titled, High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure
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Topics: Ceramics, Composite materials, Epoxy resins, Fillers (Materials), Particulate matter, Polymers, Thermal conductivity, Dielectric losses, Polymer composites
Journal Articles

An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

Krishna Tunga, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 427–433.
https://doi.org/10.1115/1.2804091
Published Online: February 13, 2007
View Article titled, An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls
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Topics: Ball-Grid-Array packaging, Ceramics, Fatigue life, Solders, Ball-Grid-Array packages, Interferometry, Lasers
Journal Articles

Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module

Y. Pang, E. Scott, J. D. van Wyk, Z. Liang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 1–8.
https://doi.org/10.1115/1.2429703
Published Online: April 16, 2006
View Article titled, Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module
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Topics: Ceramics, Cooling, Electronics, Heat, Thermal conductivity, Temperature, Thermal management
Journal Articles

Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)

John Lau, ASME Fellow, Walter Dauksher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 96–105.
https://doi.org/10.1115/1.1846069
Published Online: June 3, 2005
View Article titled, Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)
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Topics: Ceramics, Creep, Cycles, Lead-free solders, Reliability, Solders, Temperature, Printed circuit boards, Fatigue, Weibull distribution
Journal Articles

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
https://doi.org/10.1115/1.1648057
Published Online: July 8, 2004
View Article titled, Characterization of Substrate Materials for System-in-a-Package Applications
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Topics: Ceramics, Cooling, Density, Epoxy resins, Finite element methods, Manufacturing, Microwaves, Reliability, System-in-package, Thermal expansion
Journal Articles

Engineering of Superconductive Ceramics

Anatoly E. Rokhvarger, Lubov A. Chigirinsky
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 26–33.
https://doi.org/10.1115/1.1646423
Published Online: April 30, 2004
View Article titled, Engineering of Superconductive Ceramics
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Topics: Ceramics, Nanotechnology, Silver, Wire, Adhesion, Durability, Crystals, Copper, Temperature
Journal Articles

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

Seungmin Cho, Bongtae Han, Mem. ASME, Jinwon Joo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 41–47.
https://doi.org/10.1115/1.1646426
Published Online: April 30, 2004
View Article titled, Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition
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Topics: Ceramics, Deformation, Manufacturing, Solders, Temperature, Interferometry, Ball-Grid-Array packages, Stress, Displacement